Koh Young USX Series of Inspection Machines of Ultra Large, Heavy Boards Wins Two Prestigious Awards During SMTA Guadalajara

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Koh Young Technology, the leader in True3D™ measurement-based inspection solutions, proudly announced another pair of innovation awards. This time, Mexico EMS acknowledged the new USX Series of solder paste (SPI), automated optical inspection (AOI), and dispense process inspection (DPI) machines for ultra large, heavy boards with the coveted Editor’s Choice Award and the Best New SPI Product Award. Mexico EMS Editor Ron Friedman presented both awards to Koh Young during SMTA Guadalajara on 25 October 2023 at the Westin Guadalajara in Jalisco, Mexico.

“PCBs are becoming increasingly complex. Applications like LED, EV, communications, and even storage challenge manufacturers with large, heavy board designs” said Brent Fischthal, Head of Global Marketing at Koh Young Technology. “We developed and designed our new USX Series with manufacturers to help them address these challenges.” With solutions for solder paste, components, and dispensed materials like conformal coating, underfill, and flux, the USX Series handles 1,800mm (70 inch) long boards weighing upwards of 15kg (33lbs), while still delivering all the measurement-based inspection capabilities that made Koh Young the global market leader. 

An extension of its award-winning product line-up, the newly introduced USX Series continues to deliver on Koh Young’s promise to deliver critical inspection solutions to eliminate process issues and maximize production quality. Besides increased board handling capabilities, features like active warp compensation, pad-referencing, self-diagnosing maintenance, automated process controls, and foreign material inspection are just some features manufacturers can use to improve yields. 

We revolutionized the inspection process years ago with our innovative technology and became the market leader. Today, based on that proven 3D measurement-based technology, Koh Young continues to conquer new manufacturing challenges facing our industry with solutions optimized for extra-long and heavy board applications.

You can explore our solder paste inspection and award-winning True3D inspection solutions at www.kohyoungamerica.com or through these FREE downloads from Koh Young:

• The Printed Circuit Assembler's Guide to...SMT Inspection: Today, Tomorrow, and Beyond eBook
• The Companion Guide to…SMT Inspection: Today, Tomorrow, and Beyond eBook