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Advanced Electronics Packaging Digest

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GlobalFoundries Qualifies SLATE Packaging on 9SW Platform for RF Applications

06/26/2026 | GlobalFoundries
Manufactured at GF’s 300mm facility in Singapore, 9SW SLATE technology is expected to ramp to volume production by the second half of 2027.

Teledyne FLIR Defense Wins $28.8M CBP Contract for Mobile Surveillance Systems

06/24/2026 | BUSINESS WIRE
Teledyne Technologies Incorporated announced that Teledyne FLIR Defense has won a $28.8 million contract from U.S. Customs and Border Protection (CBP), an agency of the U.S. Department of Homeland Security, to support the agency’s Enhanced Mobile Surveillance Capability–Lite (eMSC-L) program to bolster border security operations.

Locus Robotics Acquires Nexera Robotics

05/21/2026 | Locus Robotics
Locus Robotics, the leader in Flexibility-First Warehouse Automation, announced the acquisition of Nexera Robotics, a Vancouver-based robotics company specializing in advanced robotic grasping.

SINBON Electronics, Nexcellent Energy Partner on Urban Hydrogen Energy

05/13/2026 | PRNewswire
"We have always believed in working with partners who share the same vision," said Alex Shiung, Business Development Assistant Vice President at SINBON. "Together, we hope to build an ecosystem that is friendly to the environment and beneficial for the planet."

Global Direct-to-Cell Market to Grow 49% YoY in 2026, Unlocking New Supply Chain Opportunities

04/27/2026 | TrendForce
Direct-to-Cell technology is rapidly maturing as global mobile communications standards 3GPP Release 17 and Release 18 continue to incorporate satellite communications.
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