Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
Global Citizenship: Together for a Perfect PCB Solution
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
KIC's Common Recipe Finder Wins 2023 Mexico Technology Award for Reflow Oven OEE Optimization
October 27, 2023 | KICEstimated reading time: 1 minute
KIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, is pleased to announce that it was honored with a 2023 Mexico Technology Award in the category of Process Control Tools for its Common Recipe Finder feature. The award was announced during a ceremony that took place Wednesday, Oct. 25, 2023 during SMTA Guadalajara in Mexico. KIC’s groundbreaking Common Recipe Finder is specifically designed to optimize the overall equipment effectiveness (OEE) of reflow ovens.
The Common Recipe Finder feature, seamlessly integrated into KIC's Profiling Software, marks a significant advancement in process control. By harnessing predictive algorithms and AI search routines, this innovative capability automates the creation of common recipes for multiple PCB assemblies. This powerful solution enables customers to streamline oven setups and reduce the number of unique recipes, ultimately leading to improved changeover operations and enhanced OEE.
One of the notable benefits of the Common Recipe Finder is the remarkable enhancement it brings to Overall Equipment Effectiveness (OEE). By optimizing the oven setup to accommodate multiple assemblies under a single recipe or a reduced number of recipes, the changeover time on the reflow oven is significantly reduced. This reduction in downtime translates to a substantial boost in productivity and operational efficiency.
Additionally, the Common Recipe Finder's optimization for common recipes mitigates the risk of loading incorrect recipes onto the oven. With a reduced number of selectable recipes, the chances of human error are minimized, ensuring the consistency and accuracy of the production process.
"Our team at KIC is elated to receive the 2023 Mexico Technology Award for our Common Recipe Finder," said Miles Moreau, General Manager at KIC. "This recognition reinforces our commitment to delivering innovative solutions that not only enhance process control but also drive operational excellence for our customers."
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
On the Line With… Podcast: UHDI and RF Performance
09/17/2025 | I-Connect007I-Connect007 is excited to announce the release of a new episode in its latest On the Line with... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
The Marketing Minute: Cracking the Code of Technical Marketing
09/17/2025 | Brittany Martin -- Column: The Marketing MinuteMarketing is never a one-size-fits-all endeavor, but the challenges are magnified for highly technical industries like electronics. Products and processes are complex, audiences are diverse, and the stakes are high, especially when your customers are engineers, decision-makers, and global partners who depend on your expertise.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.