-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
BTU International Receives Double Honors with Two 2023 Mexico Technology Awards
October 31, 2023 | BTU International, Inc.Estimated reading time: 1 minute
BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, is pleased to announce that it received not one, but two esteemed 2023 Mexico Technology Awards. The company secured recognition in the categories of Soldering Equipment – Reflow for its innovative Aurora system, and Software – Process Control for its cutting-edge Profile Tracer. These remarkable awards were announced during a distinguished ceremony held on Wednesday, Oct. 25, 2023 during the SMTA Guadalajara Expo in Mexico.
The Aurora system, a testament to BTU International's commitment to innovation, boasts an array of modern conveyor options, an updated user interface, integrated Aqua Scrub™ flux management technology, Smart Power energy savings software and advanced process control technologies. The conveyor system of the Aurora platform introduces an array of advancements, featuring five moveable rails with advanced center support options and dual-lane, dual-speed configurations. Designed concurrently to accommodate even wider boards than previous models, the conveyor platform leverages the use of common parts.
Profile Tracer, a next-generation thermal profiling tool providing real-time data acquisition for oven optimization by identifying inconsistencies due to temperature variables at both the product level and at the heat source. This exclusive tool by BTU measures dual temperature locations as well as vibration at real-time product temperature while the product completes its thermal path. Profile Tracer’s predictive capabilities go beyond traditional profilers by using internal sensors and top-of-the-line heat resistant optic windows to measure the thermal profile at the same time, location on the path, and conditions at the product level as well as at the heat source.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Saab Reveals Barracuda Poncho – Camouflage Protection for Soldiers
05/11/2026 | SaabSaab has introduced its latest iteration of camouflage solutions, a poncho to protect individual soldiers from being detected by sensors operated by opposing forces across a variety of environments.
Verda, Compal Announce Partnership to Accelerate AI Infrastructure Development and Expansion
05/11/2026 | Compal Electronics Inc.Compal Electronics and Verda, the Helsinki-headquartered European AI cloud provider, purpose-built for the demands of frontier model training and agentic inference, announced a strategic partnership under which Compal will supply next-generation GPU server systems to accelerate the build-out of its next-generation AI infrastructure across Europe and the APAC region.
Indium to Showcase High-Performance AI Application Solutions at SEMICON SEA 2026
05/01/2026 | Indium CorporationAs a leading provider of advanced materials solutions for today’s demanding AI applications, Indium Corporation® will feature its high-reliability product portfolio at SEMICON SEA 2026, May 5-7, in Kuala Lumpur, Malaysia.
Indium to Present High-Performance AI Application Solutions at SEMICON SEA 2026
05/01/2026 | Indium CorporationAs a leading provider of advanced materials solutions enabling today’s demanding AI applications, Indium Corporation® experts will share their technical insight and knowledge on two industry-critical topics at SEMICON SEA 2026, May 5-7, in Kuala Lumpur, Malaysia.
Remtec to Showcase Advanced Ceramic Technologies and Present Thermal Management for High-Power Applications at CMSE 2026
04/23/2026 | RemtecRemtec, a global leader in advanced ceramic substrates and microelectronic assembly solutions, today announced that President and CEO Brian Buyea will lead the company’s participation at Components for Military & Space Electronics Conference & Exhibition (CMSE 2026).