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BTU International Receives Double Honors with Two 2023 Mexico Technology Awards
October 31, 2023 | BTU International, Inc.Estimated reading time: 1 minute
BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, is pleased to announce that it received not one, but two esteemed 2023 Mexico Technology Awards. The company secured recognition in the categories of Soldering Equipment – Reflow for its innovative Aurora system, and Software – Process Control for its cutting-edge Profile Tracer. These remarkable awards were announced during a distinguished ceremony held on Wednesday, Oct. 25, 2023 during the SMTA Guadalajara Expo in Mexico.
The Aurora system, a testament to BTU International's commitment to innovation, boasts an array of modern conveyor options, an updated user interface, integrated Aqua Scrub™ flux management technology, Smart Power energy savings software and advanced process control technologies. The conveyor system of the Aurora platform introduces an array of advancements, featuring five moveable rails with advanced center support options and dual-lane, dual-speed configurations. Designed concurrently to accommodate even wider boards than previous models, the conveyor platform leverages the use of common parts.
Profile Tracer, a next-generation thermal profiling tool providing real-time data acquisition for oven optimization by identifying inconsistencies due to temperature variables at both the product level and at the heat source. This exclusive tool by BTU measures dual temperature locations as well as vibration at real-time product temperature while the product completes its thermal path. Profile Tracer’s predictive capabilities go beyond traditional profilers by using internal sensors and top-of-the-line heat resistant optic windows to measure the thermal profile at the same time, location on the path, and conditions at the product level as well as at the heat source.
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Indium Expert to Present on Advancing Thermal Performance at TestConX China
10/21/2025 | Indium CorporationIndium Corporation Assistant Product Manager Foo Siang Hooi will deliver a technical presentation at TestConX China, to be held November 13 in Shanghai. He will focus on advancing thermal performance in high-performance computing, automotive electronics, and power semiconductor applications with an innovative thermal interface material (TIM).
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Advanced Semiconductor Packaging Market Sees Rising Adoption Across Automotive and Industrial Sectors
10/14/2025 | openPRThe semiconductor packaging market size is estimated to reach at a CAGR of 7.2% during the forecast period (2024-2031).
Beyond Thermal Conductivity: Exploring Polymer-based TIM Strategies for High-power-density Electronics
10/13/2025 | Padmanabha Shakthivelu and Nico Bruijnis, MacDermid Alpha Electronics SolutionsAs power density and thermal loads continue to increase, effective thermal management becomes increasingly important. Rapid and efficient heat transfer from power semiconductor chip packages is essential for achieving optimal performance and ensuring long-term reliability of temperature-sensitive components. This is particularly crucial in power systems that support advanced applications such as green energy generation, electric vehicles, aerospace, and defense, along with high-speed computing for data centers and artificial intelligence (AI).
The Latest Issue: Advanced Electronics Packaging Digest to Explore Critical Minerals, Substrates, and Reliability Standards Driving Next-Gen Electronics
10/09/2025 | I-Connect007I-Connect007 is pleased to announce the upcoming issue of Advanced Electronics Packaging Digest (AEPD) on October 13, 2025, featuring expert insights on the technologies shaping the future of advanced packaging. As the electronics industry evolves, this issue takes a closer look at the materials, designs, and standards redefining performance and reliability across global markets.