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What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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BTU International Receives Double Honors with Two 2023 Mexico Technology Awards
October 31, 2023 | BTU International, Inc.Estimated reading time: 1 minute
BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, is pleased to announce that it received not one, but two esteemed 2023 Mexico Technology Awards. The company secured recognition in the categories of Soldering Equipment – Reflow for its innovative Aurora system, and Software – Process Control for its cutting-edge Profile Tracer. These remarkable awards were announced during a distinguished ceremony held on Wednesday, Oct. 25, 2023 during the SMTA Guadalajara Expo in Mexico.
The Aurora system, a testament to BTU International's commitment to innovation, boasts an array of modern conveyor options, an updated user interface, integrated Aqua Scrub™ flux management technology, Smart Power energy savings software and advanced process control technologies. The conveyor system of the Aurora platform introduces an array of advancements, featuring five moveable rails with advanced center support options and dual-lane, dual-speed configurations. Designed concurrently to accommodate even wider boards than previous models, the conveyor platform leverages the use of common parts.
Profile Tracer, a next-generation thermal profiling tool providing real-time data acquisition for oven optimization by identifying inconsistencies due to temperature variables at both the product level and at the heat source. This exclusive tool by BTU measures dual temperature locations as well as vibration at real-time product temperature while the product completes its thermal path. Profile Tracer’s predictive capabilities go beyond traditional profilers by using internal sensors and top-of-the-line heat resistant optic windows to measure the thermal profile at the same time, location on the path, and conditions at the product level as well as at the heat source.
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Rachael Temple - AlltematedSuggested Items
The Future of Reflow Soldering Is Here
04/16/2026 | Real Time with... APEX EXPOMichael Hanke discusses how Rehm Thermal Systems is revolutionizing thermal solutions in electronics assembly with their innovative flux-free, no-clean soldering process. This is truly a game changing process that eliminates chamber cleaning and streamlines production. Developed with paste suppliers, this advanced technology promises significant time and cost savings while ensuring high-quality results.
Indium Showcases Solder Alloy Reliability Research for Heterogeneous Integration at ICEP-HBS
04/15/2026 | Indium CorporationIndium Corporation Senior Global Product Manager, Semiconductor and Advanced Materials, Sze Pei Lim will present a collaborative International Electronics Manufacturing Initiative (INEMI) project comparing SnBi and SAC305 solder alloys for first-level interconnects in complex heterogeneous packages.
Carbice Awarded Multi-Million Dollar U.S. Navy Contract for Thermal Assembly Joint Technology
04/14/2026 | PRNewswireCarbice, a U.S.-based manufacturer and supplier of novel multifunctional assembly joint technologies, has been awarded a multi-million dollar contract by the U.S. Navy's Office of Naval Research.
Powering the Future: Why Thermal Management Defines the Future of Electronics
04/15/2026 | Brian Buyea -- Column: Powering the FutureEvery leap forward in electronics comes with a familiar consequence: heat. Whether it’s a power module driving an electric vehicle, a laser diode used in surgery, or a 5G amplifier operating in orbit, higher performance inevitably means higher temperatures. While engineers celebrate breakthroughs in speed, density, and power, none of those specifications matter if the system can’t keep cool long enough to perform reliably.
onsemi Powers Sineng Electric’s Advanced Solar and Energy Storage Solutions
04/08/2026 | onsemionsemi announced that its hybrid power integrated modules (PIMs) will be featured in Sineng Electric’s next-generation 430 kW liquid-cooled string energy storage systems (ESS) and 320 kW utility-scale solar inverter.