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BTU International Receives Double Honors with Two 2023 Mexico Technology Awards
October 31, 2023 | BTU International, Inc.Estimated reading time: 1 minute
BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, is pleased to announce that it received not one, but two esteemed 2023 Mexico Technology Awards. The company secured recognition in the categories of Soldering Equipment – Reflow for its innovative Aurora system, and Software – Process Control for its cutting-edge Profile Tracer. These remarkable awards were announced during a distinguished ceremony held on Wednesday, Oct. 25, 2023 during the SMTA Guadalajara Expo in Mexico.
The Aurora system, a testament to BTU International's commitment to innovation, boasts an array of modern conveyor options, an updated user interface, integrated Aqua Scrub™ flux management technology, Smart Power energy savings software and advanced process control technologies. The conveyor system of the Aurora platform introduces an array of advancements, featuring five moveable rails with advanced center support options and dual-lane, dual-speed configurations. Designed concurrently to accommodate even wider boards than previous models, the conveyor platform leverages the use of common parts.
Profile Tracer, a next-generation thermal profiling tool providing real-time data acquisition for oven optimization by identifying inconsistencies due to temperature variables at both the product level and at the heat source. This exclusive tool by BTU measures dual temperature locations as well as vibration at real-time product temperature while the product completes its thermal path. Profile Tracer’s predictive capabilities go beyond traditional profilers by using internal sensors and top-of-the-line heat resistant optic windows to measure the thermal profile at the same time, location on the path, and conditions at the product level as well as at the heat source.
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Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
The Knowledge Base: The Era of Advanced Packaging
12/23/2024 | Mike Konrad -- Column: The Knowledge BaseThe semiconductor industry is at a pivotal juncture. As the traditional scaling predicted by Moore's Law encounters significant physical and economic barriers, transistor density can no longer double every two years without escalating costs and complications. As a result, the industry is shifting its focus from chip-level advancements to innovative packaging and substrate technologies. I Invited Dr. Nava Shpaisman, strategic collaboration manager at KLA, to provide some insight.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
Teledyne FLIR, VSI Labs Testing Shows How Thermal Imaging Helps Vehicle Makers Meet Nighttime AEB Federal Safety Standards
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