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Indium to Feature Power Electronics Solutions at SEMICON Southeast Asia 2025

05/19/2025 | Indium Corporation
As a trusted leader in materials science for advanced electronics assembly, Indium Corporation® is proud to showcase its innovative power electronics solutions at SEMICON Southeast Asia 2025, May 20–22, in Marina Bay Sands, Singapore.

New Episode of NCAB Podcast Series Explores Cutting-edge Thermal Management Solutions

05/14/2025 | I-Connect007
In this episode we continue the conversation with NCAB Field Application Engineer Ryan Miller as we dive into practical design and manufacturing techniques for controlling thermal effects. Topics include via farms, insulated metal substrates, coin technology, and copper pedestals—solutions that help meet today's high-performance demands.

Laird Thermal Systems Unveils New Identity

05/05/2025 | Laird Thermal Systems
Laird Thermal Systems, a global leader in active thermal management solutions with more than 60 years of application expertise, today announced its rebrand to Tark Thermal Solutions.

Ansys Strengthens Collaboration with TSMC on Advanced Node Processes Certification and 3D-IC Multiphysics Design Solutions

04/24/2025 | PRNewswire
Through continued collaboration with TSMC, Ansys announced enhanced AI-assisted workflows for radio frequency (RF) design migration and photonic integrated circuits (PICs), and new certifications for its semiconductor solutions. Together,

Explore Thermal Management Solutions in Latest Podcast Series—New Episode Now Available

04/30/2025 | I-Connect007
I-Connect007 is excited to share the latest episode in our new podcast series! In this episode, Ryan returns to discuss practical strategies for managing heat, starting early in the design planning and specification phases. After all, prevention means there’s less to mitigate later.
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