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UL-Authorization Received for Ventec High-CTI, Halogen Free FR15.1 Substrates VT-447C and VT-441C

02/27/2024 | Ventec
Ventec International Group Co., Ltd. , is pleased to announce that UL’s evaluation of two of Ventec’s halogen-free, phenolic cured high-CTI substrates have received authorization to apply the UL mark.

iNEMI End-of-Project Webinar: Connector Reliability Test Recommendations

02/23/2024 | iNEMI
The iNEMI Connector Reliability Test Recommendations Project, Phases 1 through 3, addressed the need for a standardized reliability evaluation method for connectors.

 ROCKA Solutions' Justin Worden to Present at SMTA Dallas Expo & Tech Forum:

02/23/2024 |  ROCKA Solutions
 ROCKA Solutions is excited to announce that Justin Worden, Vice President of Sales & Marketing, will present at the upcoming SMTA Dallas Expo & Tech Forum. The event is scheduled to take place Tuesday, March 19, 2024 at the Plano Event Center.

Kerafol, X2F Partner to Revolutionize Thermal Solutions for Electronic Devices

02/09/2024 | Kerafol
Kerafol and X2F are teaming up to develop state-of-the-art thermal management solutions for electronic devices by leveraging the advantages of Kerafol's thermally conductive materials and X2F's patented controlled-viscosity molding technologies.

iNEMI LTS Tech Topic Series: Thermal Fatigue Performance in BiSn-Based Low-Temperature Solder Joints

02/05/2024 | iNEMI
There is an increasing interest in some market segments to use solder alloys with lower melting temperatures for electronics assembly. Low-temperature solder (LTS) can provide manufacturing, economic, and environmental benefits.
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