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Press-fit technology as an interconnection to printed boards (PBs) started in the telecommunication industry in the 1970s. With press-fit technology, the electro-mechanical connection between compliant pin and PB is achieved through a single insertion process, eliminating the use of auxiliary materials (e.g., flux, solder alloy, cleaning agents) and heat treatment, which makes it no surprise that not only is this technology widely used in automotive, industrial, aerospace, and many other applications, but it continues to grow.
Until May 2020, the only available press-fit standard on the market was the IEC 60352-5, which was initially developed within the context of telecommunication equipment or similar applications.
As a physicist who has spent much time for my PhD utilizing various surface analysis techniques, plating conditions, and environmental exposures to investigate the underlying mechanisms behind metal whisker growth, many of my main projects for the automotive industry were focused on the development and testing of new surface finishes for whisker mitigation of compliant press-fit pins.
However, the IEC standard at that point didn’t call out any kind of whisker testing, not to mention environmental conditions harsh enough for automotive applications. So, imagine my excitement when I saw the Cold Joining Press-Fit Task Group listed in the standards development committee meetings at IPC APEX EXPO 2019, my first-ever IPC event. Immediately, I signed up.
When I walked into that committee meeting, I saw familiar faces—acquaintances from other companies in the field whom I greatly regarded as renowned experts. As the meeting started, I couldn’t help but smile, relishing the detailed conversations. Even when members would disagree, there was always steadfast respect. Everyone really listened, contemplated, and sought to understand one another’s viewpoints. Often, it was something they hadn’t initially considered, yet realized it was important to the topic at hand.
By the end of the meeting, the final action items were concluded. Later, the first working draft was distributed for committee comments. It was a very exciting phase in the creation process of a new standard, and I wholeheartedly wanted to become an active member of the committee.
To read the rest of this article, which appeared in the Fall 2023 issue of IPC Community, click here.
