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An Introverted Physicist in a Press-Fit World
November 2, 2023 | Dr. Erika Crandall, TE ConnectivityEstimated reading time: 1 minute

Press-fit technology as an interconnection to printed boards (PBs) started in the telecommunication industry in the 1970s. With press-fit technology, the electro-mechanical connection between compliant pin and PB is achieved through a single insertion process, eliminating the use of auxiliary materials (e.g., flux, solder alloy, cleaning agents) and heat treatment, which makes it no surprise that not only is this technology widely used in automotive, industrial, aerospace, and many other applications, but it continues to grow.
Until May 2020, the only available press-fit standard on the market was the IEC 60352-5, which was initially developed within the context of telecommunication equipment or similar applications.
As a physicist who has spent much time for my PhD utilizing various surface analysis techniques, plating conditions, and environmental exposures to investigate the underlying mechanisms behind metal whisker growth, many of my main projects for the automotive industry were focused on the development and testing of new surface finishes for whisker mitigation of compliant press-fit pins.
However, the IEC standard at that point didn’t call out any kind of whisker testing, not to mention environmental conditions harsh enough for automotive applications. So, imagine my excitement when I saw the Cold Joining Press-Fit Task Group listed in the standards development committee meetings at IPC APEX EXPO 2019, my first-ever IPC event. Immediately, I signed up.
When I walked into that committee meeting, I saw familiar faces—acquaintances from other companies in the field whom I greatly regarded as renowned experts. As the meeting started, I couldn’t help but smile, relishing the detailed conversations. Even when members would disagree, there was always steadfast respect. Everyone really listened, contemplated, and sought to understand one another’s viewpoints. Often, it was something they hadn’t initially considered, yet realized it was important to the topic at hand.
By the end of the meeting, the final action items were concluded. Later, the first working draft was distributed for committee comments. It was a very exciting phase in the creation process of a new standard, and I wholeheartedly wanted to become an active member of the committee.
To read the rest of this article, which appeared in the Fall 2023 issue of IPC Community, click here.
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Waging the Battle for American PCB Reshoring
10/21/2025 | Marcy LaRont, PCB007 MagazineLegislation is shaping global trade, tariffs, and sustainability and environmental regulations. David Schild of PCBAA discusses exactly where the U.S. stands in its efforts to reshore printed circuit board manufacturing for critical industries. This conversation at PCB West occurred on the first day of the federal government’s shutdown, so it seemed especially timely to hear David's thoughts and insights on how the current political climate is affecting efforts to achieve the U.S. industry’s reshoring goals.
Dutch Government Takes Control of China-Owned Chipmaker Nexperia, Citing Security Concerns
10/14/2025 | I-Connect007 Editorial TeamThe Dutch government has taken control of Chinese-owned chipmaker Nexperia, escalating tensions with Beijing amid intensifying global disputes over semiconductor technology and intellectual property.
SEMICON West: The Path to a $1 Trillion Future
10/14/2025 | Marcy LaRont, I-Connect007After more than 50 years in San Francisco, SEMICON West moved its 2025 show to Phoenix, which is significant because it highlights the importance of Arizona as a semiconductor and tech hub. Though the show will be back in San Francisco in 2026, the overwhelmingly warm welcome SEMI received from Arizona Governor Katie Hobbs, Phoenix Mayor Kate Gallego, and ASU President Michael Crowe—who has been responsible for ASU repeatedly achieving the U.S. News and World Reports most innovative university ranking—was remarked upon repeatedly. All indications are that SEMICON West may well be back in Phoenix after that 2026 season.
Elementary, Mr. Watson: High Power: When Physics Becomes Real
10/15/2025 | John Watson -- Column: Elementary, Mr. WatsonHave you ever noticed how high-speed design and signal integrity classes are always packed to standing room only, but just down the hall, the session on power electronics has plenty of empty chairs? It's not just a coincidence; it's a trend I've observed over the years as both an attendee and instructor.
The Right Approach: Electro-Tek—A Williams Family Legacy, Part 1
10/15/2025 | Steve Williams -- Column: The Right ApproachThere is no bronze bust in the lobby or portrait in the conference room of Electro-Tek's founder—my Dad, Charles “Chuck” Williams—so with the facility closing last year after 56 years, I feel it is time to tell the story. Chuck Williams founded Electro-Tek in 1968 in our basement, eventually moving into the second floor of an old 1913 building in downtown Milwaukee that is still standing (the first of three eventual facilities).