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U.S. Circuit Acquires AS9100 Certification
November 3, 2023 | U.S. CircuitEstimated reading time: Less than a minute
U.S. Circuit, a premier supplier of commercial and mil/aero PCBs, has recently obtained their AS9100 certification.
AS9100 certification expands on the ISO9001 quality standards and adds additional regulatory requirements and notations pertaining specifically to aerospace quality needs. AS9100 is backed by the International Aerospace Quality Group (IAQG).
This certification will allow U.S. Circuit to further expand their military and aerospace offerings to further serve sectors requiring stricter regulation including the Department of Defense (DoD), National Aeronautics and Space Administration (NASA), and the Federal Aviation Administration (FAA).
Harry Patel, CEO of U.S. Circuit, stated, “We are proud to have received this important certification. I applaud the team’s dedication to improving our process across the board, enhancing the service of our military and aerospace customers. This certification will give them added confidence in our ability to deliver the highest quality printed circuit boards possible.”
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CEE PCB to Exhibit at Electronica 2024
10/31/2024 | CEE PCBTom Yang, CEO of CEE PCB, has announced that his company will be exhibiting at this year’s electronica 2024 to be held in Munich, Germany from November 12th through the 15th at the Trade Faire Center Messe München.
Flexible Thinking: Musings on High Density Interconnections
10/30/2024 | Joe Fjelstad -- Column: Flexible ThinkingPeople have been using high density interconnection (HDI) technology since the early 1980s, although it was not called HDI until the late 1990s. In the 1970s, ’80s, and early ’90s, engineers used HDI methods to develop hybrid circuits, which were later referred to as multichip modules (MCMs). These were arguably the first instantiation of heterogeneous interconnection technology, which has been the industry buzzword for almost a decade. These devices are a way of integrating multiple chips—both integrated circuits and discrete devices (resistors, capacitors, and inductors)—into a single package, typically using ceramic substrates with layers of insulation and metallic inks (often gold) and firing them at high temperatures.
Highlights of the ICT 50th Anniversary Symposium
10/24/2024 | Pete Starkey, I-Connect007Why does it always rain when I attend these events? Temperatures were dropping, daylight was shrinking, and there were seasonal colour changes in wet hedgerows as I travelled to Gloucestershire for the 50th Anniversary Symposium of the Institute of Circuit Technology at Puckrup Hall near Tewkesbury in mid-October. It was a memorable occasion: Nostalgic for my contemporaries who remembered our industry at its most prosperous, technically outstanding in the quality and significance of presentations to an attentive audience of printed circuit professionals, and complemented by the sharing of ideas, information, and trade gossip within a friendly community at the evening gathering.
Designers Notebook: Implementing HDI and UHDI Circuit Board Technology
10/23/2024 | Vern Solberg -- Column: Designer's NotebookTo accommodate new generations of high I/O semiconductor packaging, circuit board technology has undergone significant changes in both the fabrication process method and the criteria for base material selection. The reason behind these changes is the new high-function semiconductor package families that require more terminals than their predecessors and a significantly narrower terminal pitch.
Optimizing mSAP to Produce Flex for Biofluid Sensor Probes
10/17/2024 | Dean Neuburger, Sheldahl Flexible TechnologiesImprovements in flexible printed circuitry technology offer solutions that enable advancement in other technologies, enabling new circuit design and capability possibilities for customers’ applications. This article will overview advancements developed and implemented to produce a flexible circuit that meets new and challenging requirements for a customer’s medical application. This discussion will highlight development ideas more than details about the final processing scheme.