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iNEMI Packaging Tech Topic Series: Damage-Free Rapid Electron Beam Testing for Advanced Packaging

07/24/2024 | iNEMI
Testing issues are limiting chip makers’ ability to create larger SOCs (system-on-chip). The scan field dimensions of EUV (extreme ultraviolet light) and NA (numerical aperture) EUV, which are typically used for testing, are too small.

iNEMI Packaging Tech Topic Series: Damage-Free Rapid Electron Beam Testing for Advanced Packaging

07/16/2024 | iNEMI
Testing issues are limiting chip makers’ ability to create larger SOCs (system-on-chip). The scan field dimensions of EUV (extreme ultraviolet light) and NA (numerical aperture) EUV, which are typically used for testing, are too small. To enable larger chips, manufacturers are migrating to system-on-a-package (SOP).

Omdia: Mini LED backlight LCD display expected to surpass OLED display in 2025

06/19/2024 | PRNewswire
According to the latest Omdia Mini LED Backlight Market Tracker, LCD TV display equipped with mini-LED backlight unit will be reaching 6.2 million units in 2024. During the same year,

OE-A at ICFPE 2024, Taipei, Taiwan

06/11/2024 | OE-A
The International Conference on Flexible and Printed Electronics (ICFPE 2024) takes place from August 28-30, 2024, in Taipei, Taiwan. OE-A is a partner of this event and organizes a conference session.

Magnachip Mixed-Signal Unveils Power Management IC and Level Shifter for Display Panels in IT Devices

06/11/2024 | Magnachip Semiconductor
Magnachip Mixed-Signal, Ltd. announced the release of a multi-functional Power Management Integrated Circuit (PMIC) and a multi-channel level shifter to regulate different voltages and signals within display panels in IT devices.
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