-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Butterfly Effect
The basis of chaos theory is a key concept known as the “butterfly effect.” It’s the idea that a small event in one place creates a cascading set of events elsewhere. So, how is the EMS landscape changing? We’re tracking the concerns and dynamics of this landscape, and there’s a lot to learn.
Coming to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Cadence Announces Voltus InsightAI
November 6, 2023 | Cadence Design Systems, Inc.Estimated reading time: 2 minutes
Cadence Design Systems, Inc. announced the new Cadence® Voltus™ InsightAI, the industry’s first generative AI technology that automatically identifies the root cause of EM-IR drop violations early in the design process and selects and implements the most efficient fixes to improve power, performance, and area (PPA). Using Voltus InsightAI, customers can fix up to 95% of violations prior to signoff, leading to a 2X productivity improvement in EM-IR closure.
Power integrity is a major design challenge at advanced nodes, with designers regularly facing a significant number of EM-IR violations at signoff, making it imperative to address this challenge early in the design phase. One of the major bottlenecks of in-design EM-IR analysis is that it is computationally very expensive due to the size and coupled nature of the power network. The new AI-driven Voltus InsightAI helps to overcome this bottleneck by utilizing new breakthrough machine learning methods for very fast incremental IR analysis. Using Voltus InsightAI, customers can use in-design analysis to enhance on-chip and chiplet power integrity. The technology enables greater engineering efficiency for uncovering issues early and offers key productivity-enhancing features:
- Fast IR Inferencing Engine: The solution uses proprietary neural networks to build models of the power grid and can perform extremely fast incremental IR analysis to provide instant feedback on the impact of design changes.
- IR Drop Diagnostics: Voltus InsightAI uses deep learning to discover the root cause of IR drop problems and can quickly identify aggressors, victims and resistance bottlenecks. It uses electrical, spatial and timing factors for predicting IR drop issues during design.
- Multi-Method Fixing: Decision-tree methods are utilized to perform timing and design rule check (DRC)-aware fixes of IR drop, using multiple methods like placement, grid reinforcement, routing and engineering change orders (ECOs). Voltus InsightAI selects precise fixing methods based on the root cause of the problem, driving better utilization and improved PPA.
- Fully Integrated Solution: Voltus InsightAI is fully integrated with Cadence’s solutions, including the Cadence Innovus™ Implementation System, the Cadence Tempus™ Timing Solution, the Cadence Voltus IC Power Integrity Solution, and the Cadence Pegasus™ Verification System for complete IR design closure from implementation to signoff that is timing- and DRC-aware.
“As we move to more advanced nodes, EM-IR is quickly becoming one of the most pressing challenges, requiring novel and innovative approaches to address customer needs. With Voltus InsightAI, Cadence has pioneered applying generative AI technology to EM-IR, focusing not just on signoff, but early detection and prevention of EM-IR violations as well,” said Ben Gu, Corporate Vice President of R&D, Multiphysics Systems Analysis Business Unit, Cadence. “With this capability, designers don’t need to over-design the power grid, thereby enabling far better PPA. Customers are seeing impressive results as they can leverage this breakthrough technology to fix up to 95% of violations prior to signoff and achieve more than 2X productivity improvement in EM-IR closure.”
Suggested Items
Infineon Receives German Brand Award for ‘Corporate Brand of the Year’
06/17/2024 | InfineonInfineon Technologies AG received the German Brand Award in the renowned “Best of Category” as “Excellent Brands – Corporate Brand of the Year”.
Off Like a Rocket: A Review of the EIPC Summer Conference, Part 1
06/14/2024 | Pete Starkey, I-Connect007Motorway traffic jams, airport car parking, walking for miles, queuing for security, delayed flights—oh, the joys of travelling. I was quickly reminded of my status as a foreigner while waiting patiently in line for a half-hour at passport control to enter the European Union at Amsterdam Schiphol, having flown all the way from London Luton in the United Kingdom, that great distance of 200 miles.
Revolutionizing PCB Prototyping With ML and AM
06/14/2024 | Nick Geddes, Nano DimensionHistorically, PCB prototyping has been a meticulous and time-consuming process, often laden with complexities and high costs. Traditional methods have typically involved intricate design iterations, extensive manual labor, and significant material waste. However, the advent of AM has revolutionized this landscape, offering a rapid, cost-effective alternative that significantly accelerates the development cycle.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/14/2024 | Nolan Johnson, PCB007This week’s must-reads are comprised of news which moves the industry forward. We’ve had quite a lot of news on a global scale, and they’re all good reads. To winnow down to just five, I chose either new information or interesting takes on ongoing industry stories. To that end, we have news about new capital equipment for advanced packaging, discussions of material selection and the imaging process during PCB fabrication, a columnist's ode to the best engineer she knows, and some optimistic news from the semiconductor industry.
Siemens Collaborates with Samsung Foundry to Expand 3D-IC Enablement Tools
06/14/2024 | SiemensSiemens Digital Industries Software today announced that, in collaboration with Samsung Foundry, they have developed compelling new capabilities for the manufacture of multi-die packaged designs at advanced nodes and achieved a host of new product certifications for many of Siemens’ industry-leading IC design and verification technologies.