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Advanced Electronics Packaging Digest

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Suggested Items

Evaluating Physical Process Parameters to Improve Copper Plating Distribution

09/11/2026 | Richard Nichols and Marko Mirkovic, GreenSource Engineering
Consistent copper thickness across panels directly affects etching accuracy, conductor geometry, electrical performance, and ultimately, product reliability. It is a persistent manufacturing challenge, and for PCB fabricators serving advanced markets—including RF applications, power electronics, and other high-performance technologies—electrolytic copper plating is one of the most critical process steps. In response, manufacturers typically modify shielding, rectification, or tooling, which may require an expensive hardware change.

Yunlin County, Foxconn Launch 'Document Brain' Smart Service

09/01/2026 | Foxconn
The Yunlin County Government and Foxconn Technology Group announced that they have jointly developed the "Document Brain" smart agent service, which has completed its initial phase and achieved fruitful results in improving the efficiency of government administration.

DOCOMO, Samsung Electronics Achieves Successful Validation of User-level AI-RAN Technology

08/10/2026 | JCN Newswire
NTT DOCOMO, INC. and Samsung Electronics announced that they have successfully validated AI-based radio access network (AI-RAN) optimization technology at the user level.

Mycronic's Setup Optimization Genetics

07/23/2026 | Nolan Johnson, SMT007 Magazine
At Mycronic, Robert Helleday, head of R&D, and Göran Frank, head of Product Management, are quick to clarify that setup optimization is “in our DNA at Mycronic.” That’s important because, in electronics manufacturing, every minute of machine downtime directly impacts productivity, profitability, and responsiveness to customer demand. As product lifecycles shorten and high-mix, low-volume production becomes the norm, manufacturers are under increasing pressure to reduce setup times, accelerate changeovers, and improve material flow without sacrificing quality or traceability.

PDN Optimization: Balancing Performance and Cost in SoC Designs

10/22/2025 | Zach Caprai. Siemens EDA
This article demonstrates advanced PDN optimization techniques through a real-world case study of AMD’s Versal adaptive SoC platform. Using the VCK190 evaluation kit featuring the Versal AI Core series VC1902 device, I’ll explore how effective PDN design and optimization can help meet demanding technical specifications while addressing essential business goals.
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