Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
Marcy’s Musings: Can You Hear the Voices?
Facing the Future: Successfully Navigating the Uncertain Path Ahead
Simplifying Your Design
November 9, 2023 | I-Connect007 Editorial TeamEstimated reading time: 1 minute
It’s safe to say that millions of dollars, not to mention man-hours, are wasted each year because of over-constrained, overly complicated PCB designs. Much of this is due to the increase in signal speeds and rise times, even in “mature” PCBs, and the extra cost is already part of the budget.
For this issue on simplifying PCB designs, the I-Connect007 Editorial Team spoke with IPC instructor Kris Moyer about ways that designers can avoid overconstraining their designs and making them needlessly complex. As Kris says, streamlining your design comes down to having a solid understanding of fab and assembly processes and the silicon tradeoffs that can simplify or overcomplicate your design, as well as the need to start working with fabricators early in the cycle.
Andy Shaughnessy: What are some typical snafus and missteps that you see designers make to overcomplicate their designs?
Kris Moyer: Here’s what often happens: Let’s say you have one connector on your board that needs tight tolerance. But rather than dimensioning to just that connector, locally, designers will do a tight tolerance to the data from the global dimensioning system, which now constrains the entire board.
Or, if they need perfect coplanarity on a BGA part for good BGA mounting, they’ll put co-planarity back over the entire board where they don't need it, because regular chips, gull-wings, and so on don't need the same amount of coplanarity as a BGA—or they'll try to hold layer tolerances: “I need a 2-mil layer plus or minus 10%,” because they know that 10% is normal for tolerance, but they missed the part of the spec that says 10% or 1 mil, whichever is greater. Fabricators can't hold that tight a layer-to-layer tolerance when it's below a certain layer thickness.
Below about a 10-mil thickness, the best fabricators can do layer-to-layer is 1 mil for nominal processing; If you want to hold a tighter tolerance, you're paying for 100 to get five boards. That’s just a couple of examples. Another is overly tight hole tolerances: “I want to have 150-mil diameter hole ±1 mil.” Again, it's unreasonable, right?
To read the rest of this interview, which appeared in the November 2023 issue of Design007 Magazine, click here.
Share on:
Suggested Items
New High Power 3D AXI for Power Electronics from Test Research, Inc.
04/17/2025 | TRITest Research, Inc. (TRI), a leading provider of Test and Inspection solutions for the electronics manufacturing industry, proudly announces the launch of the 3D AXI TR7600HP system. Designed for power semiconductor inspection, the TR7600HP enhances accuracy and efficiency in detecting defects in components such as IGBTs, MOSFETs, SiC inverters, and Paladin Connectors.
Designers Notebook: Layer Stackup Planning for RF Circuit Boards
04/17/2025 | Vern Solberg -- Column: Designer's NotebookWhen designing multiple layer circuits requiring impedance control, the circuit board designer will work closely with an engineering specialist cognizant of RF printed circuit board design and layout, including mixed-signal applications.
Miniaturized ISFET pH Sensor Optimized for Easy Use
04/10/2025 | FraunhoferThe Fraunhofer Institute for Photonic Microsystems IPMS has achieved another milestone in chemical liquid analysis. The electronics required to control the ion-sensitive field effect transistors (ISFET) have been successfully miniaturized.
Just Because You Can, Doesn’t Mean You Should
03/20/2025 | Tony Plemel, Flexible Circuit TechnologiesDecisions are usually made by gathering information and differing opinions, then making the best choice based upon that information. The same process is used when designing flexible circuits and rigid-flex circuits. For example, when designing a flex circuit or rigid-flex circuit, we consider some basic factors.
Beyond Design: Key SI Considerations for High-speed PCB Design
03/20/2025 | Barry Olney -- Column: Beyond DesignOver the past two decades, I've simulated numerous complex, high-speed designs for customers creating computer-based products. In addition, I've conducted signal integrity software training courses and led classes on high-speed design. In this month’s column, I will reflect on the key considerations for achieving a successful high-speed PCB design that performs reliably, and I’ll highlight some of the common signal integrity issues that I frequently encounter.