-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueSales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Simplifying Your Design
November 9, 2023 | I-Connect007 Editorial TeamEstimated reading time: 1 minute

It’s safe to say that millions of dollars, not to mention man-hours, are wasted each year because of over-constrained, overly complicated PCB designs. Much of this is due to the increase in signal speeds and rise times, even in “mature” PCBs, and the extra cost is already part of the budget.
For this issue on simplifying PCB designs, the I-Connect007 Editorial Team spoke with IPC instructor Kris Moyer about ways that designers can avoid overconstraining their designs and making them needlessly complex. As Kris says, streamlining your design comes down to having a solid understanding of fab and assembly processes and the silicon tradeoffs that can simplify or overcomplicate your design, as well as the need to start working with fabricators early in the cycle.
Andy Shaughnessy: What are some typical snafus and missteps that you see designers make to overcomplicate their designs?
Kris Moyer: Here’s what often happens: Let’s say you have one connector on your board that needs tight tolerance. But rather than dimensioning to just that connector, locally, designers will do a tight tolerance to the data from the global dimensioning system, which now constrains the entire board.
Or, if they need perfect coplanarity on a BGA part for good BGA mounting, they’ll put co-planarity back over the entire board where they don't need it, because regular chips, gull-wings, and so on don't need the same amount of coplanarity as a BGA—or they'll try to hold layer tolerances: “I need a 2-mil layer plus or minus 10%,” because they know that 10% is normal for tolerance, but they missed the part of the spec that says 10% or 1 mil, whichever is greater. Fabricators can't hold that tight a layer-to-layer tolerance when it's below a certain layer thickness.
Below about a 10-mil thickness, the best fabricators can do layer-to-layer is 1 mil for nominal processing; If you want to hold a tighter tolerance, you're paying for 100 to get five boards. That’s just a couple of examples. Another is overly tight hole tolerances: “I want to have 150-mil diameter hole ±1 mil.” Again, it's unreasonable, right?
To read the rest of this interview, which appeared in the November 2023 issue of Design007 Magazine, click here.
Suggested Items
Copper Price Surge Raises Alarms for Electronics
07/15/2025 | Global Electronics Association Advocacy and Government Relations TeamThe copper market is experiencing major turbulence in the wake of U.S. President Donald Trump’s announcement of a 50% tariff on imported copper effective Aug. 1. Recent news reports, including from the New York Times, sent U.S. copper futures soaring to record highs, climbing nearly 13% in a single day as manufacturers braced for supply shocks and surging costs.
Digital Twin Concept in Copper Electroplating Process Performance
07/11/2025 | Aga Franczak, Robrecht Belis, Elsyca N.V.PCB manufacturing involves transforming a design into a physical board while meeting specific requirements. Understanding these design specifications is crucial, as they directly impact the PCB's fabrication process, performance, and yield rate. One key design specification is copper thieving—the addition of “dummy” pads across the surface that are plated along with the features designed on the outer layers. The purpose of the process is to provide a uniform distribution of copper across the outer layers to make the plating current density and plating in the holes more uniform.
Gorilla Circuits Elevates PCB Precision with Schmoll’s Optiflex II Alignment System
06/23/2025 | Schmoll MaschinenGorilla Circuits, a leading PCB manufacturer based in Silicon Valley, has enhanced its production capabilities with the addition of Schmoll Maschinen’s Optiflex II Post-Etch Punch system—bringing a new level of precision to multilayer board fabrication.
Sierra Circuits Boosts High Precision PCB Manufacturing with Schmoll Technology
06/16/2025 | Schmoll MaschinenSierra Circuits has seen increased success in production of multilayer HDI boards and high-speed signal architectures through the integration of a range of Schmoll Maschinen systems. The company’s current setup includes four MXY-6 drilling machines, two LM2 routing models, and a semi-automatic Optiflex II innerlayer punch.
Elementary, Mr. Watson: PCB Routing: The Art—and Science—of Connection
06/11/2025 | John Watson -- Column: Elementary, Mr. WatsonMany people who design circuit boards love the routing part of the design. This is partially because we want to stop looking at the annoying rat's nest of connections, which seem to have no rhyme or reason at first glance. We want to get to something more exciting. Routing is the ultimate part of solving the puzzle. You take all the messy lines from the schematic and turn them into neat, organized paths.