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What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Nihon Superior’s Keith Sweatman Wins a Coveted SMTA International Best Paper Award
November 13, 2023 | Nihon Superior Co. LtdEstimated reading time: 2 minutes
Nihon Superior Co. Ltd., a supplier of advanced joining materials, proudly announces that their Senior Technical Advisor, Keith Sweatman, has been honored with a coveted SMTA International Best Paper Award. This prestigious award was presented during the SMTA International 2023 Recognition Dinner, where Keith Sweatman was acknowledged as one of the four speakers who presented papers at the 2022 conference that were judged by their peers as the best in their respective categories.
Keith Sweatman's award-winning paper, titled "The Effect of Strain Rate on the Ductility of Bismuth-Containing Solders," may seem to be remote from the day-to-day realities of electronics manufacturing. However, it has been acknowledged as making a significant contribution to an issue that is presenting a challenge comparable with that which the industry had to face two decades ago when, driven by the EU RoHS Directive, it had to move to lead-free solders.
Sweatman's paper provides an insight into one of the challenge the electronics manufacturing industry faces as it struggles to respond to the need to reduce the temperature required for soldering processes; the tendency of low temperature solder alloys containing bismuth to brittle failure. He reported the results of a study in which it was found that in tensile testing at a low strain rate even alloys with a high bismuth content could exhibit considerable ductility because of a change in the way the bismuth phase responds to stress. These findings provide a basis for the development solder alloys that will make it possible for the electronics manufacturing industry to move to low temperature soldering without compromising reliability.
The work reported was conducted by a team of researchers working under the guidance of Professor Kazuhiro Nogita at the Nihon Superior Centre for the Manufacture of Electronic Materials, located on the University of Queensland campus in Australia.
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The Journey from Dilution to Zero Liquid Discharge
05/11/2026 | Richard Nichols, GreenSource EngineeringIf you’re familiar with the PCB industry, and a little long in the tooth like me, you may remember the cry, “The water board is here!” (or an equivalent authority). This was the signal for a frantic but regularly rehearsed exercise to turn on all the rinses. This anecdote demonstrates that in the early days of PCB production, prevailing practices revolved around a “dilution is the solution” mentality, in which manufacturers used copious amounts of water to dilute contaminants before discharging them into regulated municipal wastewater systems or natural water bodies.
Hall of Fame Spotlight Series: Highlighting Karen McConnell
05/07/2026 | Dan Feinberg, I-Connect007In 2021, Karen McConnell was awarded the Raymond E. Pritchard Hall of Fame award in recognition of her contributions to the Association and the electronics industry. As a senior staff member and CAD/CAM engineer at Northrop Grumman Enterprise Services, her primary responsibility was to develop a common, shared EDM (Electronic Document Management) library to support the electrical and PCB design tool initiatives across Northrop Grumman Mission Systems.
A Necessary Shift From Gerber to IPC-2581
05/07/2026 | Tracy Riggan, Global Electronics AssociationIPC-2581 is an open, vendor-neutral data exchange standard developed by the Global Electronics Association to streamline the exchange of PCB design information across fabrication, assembly, and test. It replaces multiple legacy formats—including industry standards, Gerber, and ODB++—with a single, comprehensive, XML-based dataset that captures all manufacturing details.
When Quality Is Personal: The Human Stakes Behind Electronics Reliability
05/06/2026 | Kelly DackIn electronics manufacturing, quality is often discussed in terms of specifications, standards, and process controls, but as industry veteran Doug Pauls reminds us, the stakes are far more human. In this conversation, Doug, a recipient of the Global Electronics Association’s Hall of Fame Award, draws on more than four decades of experience to illuminate the real-world consequences of reliability, where even a single defect can carry profound implications. He brings into sharp focus why quality isn’t just a metric, but a responsibility shared by everyone on the manufacturing floor.
PCBAA, AAM Take on the Fight to Rebuild U.S. Manufacturing in New Documentary
05/05/2026 | Marcy LaRont, I-Connect007Throughout most of the 20th century, manufacturing was central to the American Dream of providing stable jobs and pathways to upward mobility. Today, more than 80% of global electronics manufacturing capacity resides in China and greater Asia, raising serious concerns about supply chain resilience and national security.