It’s Only Common Sense: Invest in Yourself—You’re Your Most Important Resource
Dan's Biz Bookshelf: 'Revenge of the Tipping Point'
Marcy's Musings: Engineering Economics
Munich Opening Its Doors to productronica 2023 This Week
November 13, 2023 | Barry Matties, I-Connect007Estimated reading time: 1 minute
Productronica 2023, one of the world’s biggest electronics manufacturing trade shows, begins Tuesday in Munich. The key topics for this year’s forums and live demonstrations are power electronics, AI, and sensors in electronics production.
The show features more than 1,300 exhibitors occupying nearly 90,000 square meters in eight halls of the massive 200,000 square meter venue. The biannual event, established in 1975, is organized by Messe Munchen, a trade fair company that organizes more than 50 events worldwide. Show organizers say that productronica is “the only event of its kind to showcase the entire value chain in electronics production.”
The productronica Career Area is staffed with consultants who can offer advice about jobs in electronics manufacturing as well as tips on hiring negotiations and a resume review. If you are looking for a new career in electronics manufacturing, this could be a good stop for you.
At the last event in 2021, there were 897 exhibitors from 39 countries along with close to 20,000 visitors from 68 countries, with the top five being Italy, France, Austria, Switzerland, and Turkey.
IPC is a recognized partner of productronica. In addition to its exhibit, IPC will host the IPC Hand Soldering World Championship in booth #A4-502. Also at the booth, the IPC Forum will feature a new program covering a wide array of topics, including technology solutions, design, CFX, sustainability, and more. Be sure to stop by for all the details.
All in all, productronica 2023 is sure to be a successful event, offering a wide range of opportunities for you to improve your knowledge, network, make some key purchase decisions, connect with old friends, and make some new ones. We look forward to seeing you here.
Share on:
Suggested Items
NEOTech Significantly Improves Wire Bond Pull Test Process
11/25/2024 | NEOTechNEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, proudly announces a major advancement in its wire bond pull testing process, reducing manufacturing cycle time by more than 60% while maintaining industry-leading production yields of over 99.99%.
PCB Design Software Market Expected to Hit $9.2B by 2031
11/21/2024 | openPRThis report provides an overview of the PCB design software market, detailing key market drivers, challenges, technological advancements, regional dynamics, and future trends. With a projected compound annual growth rate (CAGR) of 13.4% from 2024 to 2031, the market is expected to grow from USD 3.9 billion in 2024 to USD 9.2 billion by 2031.
IPC Issues Clarion Call for EU to Reclaim Leadership in Electronics Manufacturing
11/21/2024 | IPCIPC released a synopsis of its recent white paper, Securing the European Union’s Electronics Ecosystem. This condensed document presents a comprehensive overview of the current challenges in Europe’s electronics manufacturing industry and shares actionable steps to help the EU achieve a stronger, more autonomous ecosystem.
IPC Celebrates National Apprenticeship Week with a Focus on Electronics Manufacturing Excellence
11/19/2024 | IPCIPC, a leading global electronics industry association and source for industry standards, training and advocacy, is proud to announce its participation in National Apprenticeship Week, scheduled for November 17-23, 2024.
IPC Introduces First Standard for In-Mold Electronics
11/18/2024 | IPCIPC announces the release of IPC-8401, Guidelines for In-Mold Electronics. IPC-8401 addresses in-mold electronics (IME) technology, providing industry consensus on guidelines for manufacturing processes, part structures, material selection, and production test methods to integrate printed electronics and components into 3D smart structures.