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L3Harris, Palantir Announce Strategic Partnership

10/24/2024 | BUSINESS WIRE
L3Harris Technologies and Palantir Technologies Inc. announced a strategic partnership to propel advanced technology development and accelerate L3Harris’ digital transformation.

Unlock Unmatched Performance for Matched Impedance Devices with StratEdge at IEEE BCICTS 2024

10/22/2024 | StratEdge
StratEdge Corporation, an industry leader in high-frequency and high-power semiconductor packaging, is excited to announce its participation in the IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS).

High Density Packaging User Group Announces Dynamic Electronics Membership

10/14/2024 | High Density Packaging User Group
High Density Packaging User Group (HDP) is pleased to announce that Dynamic Electronics Co., Ltd. (Dynamic) has become a member.

Nordson EFD Wins a 2024 Edge Award for the PICO® Nexμs Jetting System

10/08/2024 | Nordson EFD
Nordson EFD, a Nordson company (NASDAQ: NDSN), announced its new-to-market PICO Nexμs jetting system has been recognized by Machine Design magazine with a 2024 Edge Award in the Automation & IIOT category.

Qualcomm, Sequans Complete Sale of 4G IoT Technology

10/07/2024 | Qualcomm Incorporated
Qualcomm Incorporated, a global leader in high-performance at low-power solutions, through its subsidiary, Qualcomm Technologies, Inc., and Sequans Communications S.A., a supplier of 4G and 5G semiconductor solutions for the Internet of Things (IoT), announced that they have completed the sale of Sequans’ 4G IoT technology to Qualcomm.
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