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Clear Demand Signal Needed for CHIPS Success

08/01/2025 | I-Connect007 Editorial Team
In July, the National Defense Industrial Association’s (NDIA) Electronics Division released a white paper titled Clear Demand Signal Needed for CHIPS Success. The paper highlights the importance of the CHIPS and Science Act’s $52 billion investment in revitalizing secure domestic semiconductor production, but also raises the alarm that the Act mainly addresses supply challenges and has not established mechanisms to ensure ongoing demand for U.S.-based microelectronics production.

SES, the Luxembourg Government to Develop and Launch New Defence Satellite for GovSat

07/25/2025 | BUSINESS WIRE
SES and the Luxembourg Government today announced their plan for development of a second satellite for GovSat (LuxGovSat S.A.), the public-private partnership and 50/50 joint venture between SES and the Luxembourg Government that provides secure, reliable and accessible satellite communication services for governments.

Report: Broadcom Scraps $1 Billion Chip Investment in Spain

07/15/2025 | I-Connect007 Editorial Team
American chipmaker Broadcom has pulled out of plans to invest in a microchip plant in Spain. According to a July 14 Reuters report, Europa Press, quoting anonymous sources, stated the action followed collapsed government talks but gave no further information.

PCBAA’s David Schild: Where U.S. Electronics Manufacturing Stands Today

07/14/2025 | Marcy LaRont, I-Connect007
As the U.S. Congress looks toward a summer break, David Schild of PCBAA discusses the growing momentum in U.S. electronics manufacturing policy, emphasizing bipartisan support for reshoring efforts, the importance of targeted tax incentives, and the challenges posed by global competition. He highlights PCBAA’s growth, advocacy on Capitol Hill, and the need for sustained investment to revitalize the PCB industry.

The Government Circuit: From Tax Policy to Tariffs, Denver to Delhi, Speaking Up for Electronics 

06/18/2025 | Chris Mitchell -- Column: The Government Circuit
I had the privilege of attending the June 3 opening ceremony of AT&S’s HTB3 facility in Leoben, Austria—a milestone moment for Europe’s electronics ecosystem. HTB3 is now the first and only facility in Europe capable of both developing and producing high-performance IC substrates—the advanced platforms that allow powerful chips to connect, process, and function. As demand for AI, 5G, and other cutting-edge technologies grows, so too does the need for sophisticated substrates like those HTB3 will produce.
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