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Advanced Electronics Packaging Digest

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Sumitomo Chemical Subsidiary to Establish of a Joint Venture with Samsung Electro-Mechanics for the Glass Core Substrate Business

07/13/2026 | Sumitomo Chemical
Sumitomo Chemical today announced that its wholly owned Korean subsidiary, Dongwoo Fine-Chem Co., Ltd. , has signed a joint venture agreement with Samsung Electro-Mechanics Co., Ltd. to establish a joint venture company that will engage in the business of glass core substrates for advanced semiconductor packages.

SandboxAQ Secures $500M CHIPS R&D Award

07/13/2026 | SandboxAQ
SandboxAQ announced a definitive agreement with the U.S. Department of Commerce’s CHIPS Research and Development Office for a $500 million award to address one of the most urgent challenges in American manufacturing: the foreign control of critical materials and chemistries that are essential to semiconductor manufacturing.

QuantumDiamonds Raises €91M for Next-Gen Chip Inspection

07/13/2026 | QuantumDiamonds
QuantumDiamonds GmbH (QD), one of Europe's fastest-growing semiconductor equipment companies, announced the closing of a €91 million funding round to scale production of its quantum-based semiconductor inspection technology.

Micron Accelerates U.S. Investments, Pours First Concrete at New York Fab

07/12/2026 | Micron
Micron Technology, Inc.  announced it is accelerating its planned U.S. fab and technology investments and increasing its expected spend to more than $250 billion through 2035, driven by surging demand for memory in the AI era.

Edge AI Semiconductor Market Size to Hit $151.30 Billion by 2035

07/10/2026 | Globe Newswire
The global Edge AI Semiconductor Market Size was valued at $25.36 Billion in 2025 and is projected to reach $151.30 Billion by 2035, growing at a CAGR of 19.57% during 2026–2035.
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