Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

BEST Inc. Presents StencilQuik for Simplifying BGA Rework Challenges

04/02/2025 | BEST Inc.
BEST Inc., a leader in electronic component rework services, training, and rework tools is thrilled to announce StencilQuik™ rework stencils. This innovative product is specifically designed for placing Ball Grid Arrays (BGAs) or Chip Scale Packages (CSPs) during the rework process.

epoxySet Launches UV-8675 – Deep Section, UV Cured Adhesive for PVC

02/19/2025 | epoxySet
epoxySet   introduces the UV-8675, acrylated urethane adhesive for bonding PVC, polycarbonate and most other plastics.  Designed for bonding PVC tubing in medical devices, it also bonds well to glass and metals. This semirigid polymer offers high bond strength without causing stress cracks. 

iNEMI and MIT Conduct Survey on Optical Adhesives for High-Volume Photonics

01/21/2025 | iNEMI
The International Electronics Manufacturing Initiative (iNEMI), in conjunction with MIT's FUTUR-IC initiative, is conducting a survey to understand the status of stakeholders, materials, applications, standards and test methods for high-volume deployment of optical adhesives for optoelectronics applications, particularly for silicon photonics and co-packaged optics.

Dymax to Showcase Innovative Adhesives at COMPAMED 2024

11/08/2024 | Dymax
Dymax, a leading manufacturer of rapid curing materials and equipment, will showcase its latest developments in medical technology at this year’s COMPAMED in Düsseldorf, from November 11 to 14, in Hall 8B, Booth L01.

ESCATEC Pushes New Boundaries in Micro-electronics with UV Enhanced Die Bonder Technology

10/30/2024 | ESCATEC
Electronics Manufacturing Services (EMS) provider, ESCATEC, has successfully integrated a UV light feature to its die bonder, significantly enhancing the precision and efficiency of the micro-assembly processes.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in