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Suggested Items

New Podcast Episode: “Bonding Innovation: How Adhesives and Coatings Are Powering the Next Generation of Electronics”

11/05/2025 | I-Connect007
I-Connect007 has released of a new episode in its Voices of the Industry podcast series, titled “Bonding Innovation: How Adhesives and Coatings Are Powering the Next Generation of Electronics.” Hosted by Nolan Johnson, this insightful discussion dives deep into the evolving world of adhesives and coatings—materials that are redefining performance, reliability, and design in modern electronics manufacturing. Dymax's Doug Katze, a leading expert in adhesive technologies, delivers what can only be described as a master class on how these critical materials are adapting to meet rapidly changing market demands.

Light-curable Solutions for Reliable Electronics in Space Applications

10/15/2025 | Virginia Hogan, Dymax
Designing electronics for space environments, particularly those in low Earth orbit (LEO), requires careful consideration of materials that can withstand extreme conditions while supporting long-term reliability. Engineers designing satellite systems, aerospace instrumentation, and high-altitude platforms face a familiar set of challenges: contamination control, mechanical stress, thermal cycling, and manufacturability.

Dymax's New 9773 Ruggedized Adhesive Meets NASA ASTM E595 Low Outgassing

10/07/2025 | Dymax
Dymax, a leading manufacturer of rapid and light-curing materials and equipment, is pleased to add 9773 ruggedizing and staking adhesive to its portfolio of materials designed for coating, protecting, and securing components on printed circuit boards in satellites, missiles, and space applications.

DELO Validates Reliability of Adhesives in miniLED Connections, Paving Way for Scalable MicroLED Production

09/10/2025 | DELO
DELO has conducted extensive reliability tests on directional conductive adhesives, confirming their suitability as a robust alternative to solder in miniLED display manufacturing.

BEST Inc. Presents StencilQuik for Simplifying BGA Rework Challenges

04/02/2025 | BEST Inc.
BEST Inc., a leader in electronic component rework services, training, and rework tools is thrilled to announce StencilQuik™ rework stencils. This innovative product is specifically designed for placing Ball Grid Arrays (BGAs) or Chip Scale Packages (CSPs) during the rework process.
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