Defense Speak Interpreted: Update on the Continuing Resolution and Budget Process for Defense
American Made Advocacy: Reshoring—About Trust, Not Just Geography
Beyond the Board: The Future of Innovation—Why the Electronics Industry Needs You
DOD Awards $39.9 Million to Strengthen U.S. Supply Chains for PCBs
November 16, 2023 | U.S. DoDEstimated reading time: Less than a minute
The Department of Defense announced an award of $39.9 million via the Defense Production Act Investment (DPAI) Program to Calumet Electronics Corporation to enhance capabilities to produce High-Density Build-Up (HDBU) substrates, which include High-Density Interconnect Printed Circuit Board (PrCB) cores and HDBU build-up layers.
"The Biden Administration has prioritized the need to support and advance the domestic PrCB and advanced packaging industrial base," said Dr. Laura Taylor-Kale, Assistant Secretary of Defense for Industrial Base Policy. "These technologies are critical for modern weapons systems and will contribute to maintaining our warfighting edge over potential adversaries."
The award will enable Calumet to scale up engineering, tooling, and manufacturing operations to establish domestic production capabilities for HDBU substrates. HDBU substrates and advanced packaging are critical enabling technologies for sixth generation systems and applications, including for radar, electronic warfare, processing, and communications. The place of performance is Calumet, Michigan.
To date, in calendar year 2023, the DPAI Program has made 22 awards totaling $714 million. DPAI is overseen by the ASD(IBP)’s Manufacturing Capability Expansion and Investment Program (MCEIP), in the Office of the Deputy Assistant Secretary of Defense for Industrial Base Resilience.
Share on:
Suggested Items
L3Harris Expands Indiana Facility to Support America’s Golden Dome
04/18/2025 | L3Harris TechnologiesL3Harris Technologies has completed a $125 million expansion at its space manufacturing facility in Fort Wayne to support the Department of Defense’s urgent need for on-orbit technology to defend the homeland by building a “Golden Dome” around the United States.
Safran Inaugurates Advanced Manufacturing and Engineering Hub in Colorado to Propel Innovation in Satellite Propulsion
04/17/2025 | PRNewswireJoe Bogosian, CEO of Safran Defense & Space, Inc. (Safran DSI), and Pier Roviera, President of Space Solutions at Safran DSI, inaugurated the company's new manufacturing facility in Parker, Colorado, on April 11.
Teledyne FLIR Defense Awarded $74.2M U.S. Army Contract
04/10/2025 | BUSINESS WIRETeledyne FLIR Defense, part of Teledyne Technologies Incorporated,, announced it has been awarded a four year, $74.2 million contract by the U.S. Army for continued development of the next-generation mounted reconnaissance capability for the M1135 Stryker’s Nuclear, Biological and Chemical Reconnaissance Vehicle (NBCRV) Sensor Suite Upgrade Program.
Molex Releases New Report on Strategies for Advancing Rugged, Reliable Connectivity in Modern Aerospace and Defense Applications
04/01/2025 | MolexMolex, a global electronics leader and connectivity innovator, has released a new report from AirBorn, a Molex company, which explores the unrelenting demands for constant, continuous connectivity to support the rigors of modern aerospace, defense and space-industry applications.
PGZ, Safran to Pursue Further Cooperation
04/01/2025 | SafranPolska Grupa Zbrojeniowa S.A. and Safran, a French high-technology group and major player in aerospace and defense, have signed a Memorandum of Understanding to jointly pursue further business opportunities as part of European defense industry cooperation efforts.