-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Spotlight on Mexico
Mexico isn’t just part of the electronics manufacturing conversation—it’s leading it. From growing investments to cross-border collaborations, Mexico is fast becoming the center of electronics in North America. This issue includes bilingual content, with all feature articles available in both English and Spanish.
Production Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Texas Instruments Chairman Rich Templeton Elected Chair of SIA
November 17, 2023 | SIAEstimated reading time: 2 minutes
The Semiconductor Industry Association (SIA) announced Texas Instruments Chairman of the Board Rich Templeton has been elected Chair of the SIA Board of Directors and Western Digital CEO David Goeckeler has been elected SIA Vice Chair. SIA represents 99% of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms.
“It is a great pleasure to welcome our new leadership team for the year ahead, Rich Templeton of Texas Instruments and David Goeckeler of Western Digital,” said John Neuffer, SIA President and CEO. “Rich is extremely knowledgeable about the challenges we face as an industry and how we can overcome them, and David is a seasoned industry veteran and a highly effective champion for SIA’s priorities. Together, they will make an outstanding team as leaders of the SIA Board of Directors in 2024.
Templeton became Chairman of Texas Instruments in April 2008 and was President and CEO from May 2004 through March 2023. From April 2000 through April 2004, Templeton was Chief Operating Officer of TI. He was Executive Vice President of the company and President of TI’s semiconductor business from June 1996 through April 2004. As CEO, Templeton maintained the company’s strategic investments in R&D and manufacturing, while expanding the size of the sales and applications engineering team to better serve TI customers. Under his leadership, TI emerged stronger, with better technological and product positions in both its core businesses. Templeton joined the company in 1980 after earning a B.S. in electrical engineering from Union College in New York.
“Semiconductor technology is making the world smarter, greener, more efficient, and better connected, and effective government policies are needed to help the industry continue to grow and innovate,” said Templeton. “I look forward to working alongside my colleagues on the SIA Board to advocate for industry priorities in Washington and capitals around the world.”
Since joining Western Digital in March 2020, Goeckeler has focused on the company’s transformation as the leading data storage producer in the industry. Before becoming CEO, he was Executive Vice President and General Manager of Cisco’s Networking and Security Business, with responsibility for more than $34 billion of the company’s global technology franchise. He led a worldwide team of more than 25,000 engineers and oversaw Cisco’s networking and security strategy and market acceleration, including development operations for the company’s expansive technology portfolio and strategic acquisitions.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
SAICEC, Siemens to Accelerate Chip-to-Vehicle Validation Using Digital Twin Technology
11/17/2025 | SiemensSiemens announced that SAICEC, a leading provider of chip and system design services for the automotive industry, has begun building complex digital twins of automotive architectures based on Siemens’ PAVE360™ software, facilitating comprehensive verification of automotive components from system-level to chip-level.
November 2025 PCB007 Magazine: Getting to Know Our Columnists
11/17/2025 | I-Connect007 Editorial TeamThis month, PCB007 Magazine expresses gratitude to the industry columnists who share their expertise, insights, and perspectives each month. From technical innovations and process improvements to marketing and management strategies, these contributors form the backbone of our mission to educate and connect the PCB industry.
ioTech Introduces io600
11/14/2025 | ioTechAhead of productronica 2025, ioTech unveils the io600, a next-gen platform that brings intelligence, scalability, and agility to digital material deposition.
Discover the Benefits of Inkjet with Electra Polymer at Productronica 2025
11/10/2025 | Electra Polymers LtdElectra Polymers will be showcasing ElectraJet® EMJ110, our advanced low-loss inkjet soldermask, ideal for high-speed and high-frequency PCB applications, at productronica 2025.
Nortech Systems Incorporated Earns AS9100 Certification for Monterrey, Mexico Facility
11/04/2025 | BUSINESS WIRENortech Systems, Incorporated, a leading provider of design and manufacturing solutions for complex electromedical devices and electromechanical systems, announced that its Monterrey, Mexico, facility has achieved AS9100:D certification.