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Texas Instruments Chairman Rich Templeton Elected Chair of SIA
November 17, 2023 | SIAEstimated reading time: 2 minutes
The Semiconductor Industry Association (SIA) announced Texas Instruments Chairman of the Board Rich Templeton has been elected Chair of the SIA Board of Directors and Western Digital CEO David Goeckeler has been elected SIA Vice Chair. SIA represents 99% of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms.
“It is a great pleasure to welcome our new leadership team for the year ahead, Rich Templeton of Texas Instruments and David Goeckeler of Western Digital,” said John Neuffer, SIA President and CEO. “Rich is extremely knowledgeable about the challenges we face as an industry and how we can overcome them, and David is a seasoned industry veteran and a highly effective champion for SIA’s priorities. Together, they will make an outstanding team as leaders of the SIA Board of Directors in 2024.
Templeton became Chairman of Texas Instruments in April 2008 and was President and CEO from May 2004 through March 2023. From April 2000 through April 2004, Templeton was Chief Operating Officer of TI. He was Executive Vice President of the company and President of TI’s semiconductor business from June 1996 through April 2004. As CEO, Templeton maintained the company’s strategic investments in R&D and manufacturing, while expanding the size of the sales and applications engineering team to better serve TI customers. Under his leadership, TI emerged stronger, with better technological and product positions in both its core businesses. Templeton joined the company in 1980 after earning a B.S. in electrical engineering from Union College in New York.
“Semiconductor technology is making the world smarter, greener, more efficient, and better connected, and effective government policies are needed to help the industry continue to grow and innovate,” said Templeton. “I look forward to working alongside my colleagues on the SIA Board to advocate for industry priorities in Washington and capitals around the world.”
Since joining Western Digital in March 2020, Goeckeler has focused on the company’s transformation as the leading data storage producer in the industry. Before becoming CEO, he was Executive Vice President and General Manager of Cisco’s Networking and Security Business, with responsibility for more than $34 billion of the company’s global technology franchise. He led a worldwide team of more than 25,000 engineers and oversaw Cisco’s networking and security strategy and market acceleration, including development operations for the company’s expansive technology portfolio and strategic acquisitions.
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Confronting an Era of Transformation in Europe
01/13/2026 | Marcy LaRont, I-Connect007If 2024 and 2025 felt turbulent inside your factory walls, the data now confirms it: Europe’s electronics manufacturing sector has entered a period of significant transition. At productronica, the Global Electronics Association’s industry intelligence team presented an overview of the European EMS industry, and what emerged was more than a portrait of a market cycling down.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
01/09/2026 | Nolan Johnson, SMT007 MagazineHappy New Year, everyone! This year promises to be a year of evolution and change. If you didn’t catch Michelle Te’s video review of the most-read stories of 2025, be sure to visit our LinkedIn page for the update. Expect to see changes here at I-Connect007 in 2026 as well. We’re cooking up new ways to better bring you the kind of coverage we do best: reporting that gets under the surface. We’re always asking, “What does that mean to the industry?”
I-Connect007 Welcomes New Columnist Brian Buyea: Powering the Future
01/07/2026 | I-Connect007 Editorial TeamI-Connect007 is excited to announce the addition of its newest columnist, Brian Buyea, president of Remtec, Inc. His column will appear regularly in I-Connect007 magazines and newsletters. Every generation of electronic innovation faces the same invisible enemy: heat. As power levels rise and footprints shrink, the battle for reliability, performance, and longevity comes down to one question: How well can you move the heat?
Texas Instruments Starts Production at New 300mm Fab in Sherman, Texas
01/02/2026 | Texas InstrumentsTexas Instruments (TI) announced the start of production at its newest semiconductor fab in Sherman, TX, just three and a half years after breaking ground.
Safran Develops Eurofl’Eye, the New Advanced Vision Technology for NH90 Helicopters
12/30/2025 | SafranSafran Electronics & Defense announces the signing of a major contract with the NATO Helicopter Management Agency (NAHEMA) for the development of the Eurofl’Eye distributed panoramic vision system.