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Solder Printing: A 1:1 Ratio of Technical and Creative

09/03/2024 | Nolan Johnson -- Column: Nolan's Notes
When things get technical, I’m in my happy place. It’s why I work in technology in the first place. I also happen to enjoy creative pursuits, and my real happy place is when both happen at the same time. Over the years, it seems that most of us engaged in printed circuit design and manufacturing are similarly wired. I don’t think I’m alone in stating that finding a creative solution to a technical problem is one of the highlights of our workday. We get bonus points if the solution is particularly simple or uncomplicated.

nano3Dprint Unveils Cutting-Edge Conductive Silver Ink Products in Collaboration with Creative Materials

08/27/2024 | PRWEB
nano3Dprint, a leading additive manufacturing and printed electronics solutions provider, is thrilled to announce the launch of its groundbreaking Conductive Silver Ink Products for use in nano3Dprint's A2200, B3300 and MatDep Pro 3D printers.

Indium Awards Silver Quill Honor to Authors of Cutting-Edge Technical Content

08/08/2024 | Indium Corporation
Indium Corporation has honored nine of its employees for their technical industry contributions with its annual Silver Quill Award. While the company’s thought leaders present technical content at industry events throughout the year, Silver Quill provides special recognition to the most innovative and cutting-edge papers.

Reassessing Surface Finish Performance for Next-gen Technology, Part 2

03/04/2024 | Frank Xu, PhD and Martin Bunce of MacDermid Alpha, and John Coonrod of Rogers Corp.
The introduction of 5G/6G has created a growing demand for faster rates of data transfer and operation at higher frequencies, pushing signals to travel toward the outer edges of conductors. As a result, the surface finish applied over the copper circuitry is now gaining more attention.

MacDermid Alpha's Sintering Technologies Take Center Stage at PCIM Asia

08/29/2023 | MacDermid Alpha
MacDermid Alpha Electronic Solutions, a leader in integrated technologies and materials for the electronics industry, will present and showcase their advanced solutions for die, package, and die top-side attach at PCIM Asia, held at Shanghai New International Expo Center - SNIEC, 29 - 31 August 2023.
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