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Connect the Dots: What Designers Should Know About Non-conductive Via Fill

05/28/2026 | Matt Stevenson -- Column: Connect the Dots
The rapid advance of technology is driving changes in electronics that require increasingly smaller boards capable of handling higher signal speeds and supporting more robust software applications. Manufacturers are increasingly called upon to produce ultra high density interconnect (UHDI) PCBs, so it’s important to tune our production capabilities and customer service models to this trend. Non-conductive via fill (NCVF) offers a cost-effective, reliable manufacturing method that accommodates the densely packed, fine-pitch ball grid array (BGA) components present in UHDI designs.

Rethinking Stackup, Materials, and Tolerances in Modern Designs

05/18/2026 | Kristin Moyer, Global Electronics Association
The simple rectangular rigid PCB is becoming increasingly infrequent. This reality necessitates designing with concepts well outside traditional rigid PCB methodologies. For example, the designer of wearable electronics may need to implement conductive fibers integrated into the textile material. Heads-up displays, like those in VR/AR headsets and glasses, require transparent circuitry etched into the display glass. The process of designing without a rule book usually starts with something other than the traditional board design process.

Jeonbuk Researchers Advance Segregated Composite Fabrication and Modeling

03/18/2026 | PRNewswire
Modern portable and wearable electronic devices increasingly integrate high-performance components and wireless communication technologies. While this integration enhances functionality, it also raises the risk of electromagnetic interference (EMI) and heat accumulation, both of which can degrade device performance and reliability.

ICT Winter Seminar: Leading-edge Developments in Electronics Manufacturing

01/29/2026 | Pete Starkey, I-Connect007
Early fog made the journey challenging for those travelling from afar, but it lifted to reveal a clear blue sky over Hinckley, Leicestershire, which is actually closer to the exact geographical centre of England than the familiar Meriden venue, for the Institute of Circuit Technology winter seminar in December. An intriguing programme, focused on some leading-edge developments in electronics manufacturing, more than justified the effort to attend.

Cabot Signs Multi-Year Supply Agreement with PowerCo SE

01/15/2026 | Cabot Corporation
Cabot Corporation, a global leader in specialty chemicals and performance materials, announced it has signed a multi-year supply agreement with PowerCo SE, a leading European original equipment manufacturer (OEM) in the electric vehicle (EV) battery sector.
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