Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
Marcy’s Musings: Can You Hear the Voices?
Facing the Future: Successfully Navigating the Uncertain Path Ahead
Registration: From Raw Data to Intelligent Manufacturing
November 27, 2023 | Andrew Kelley, XACTPCB LTDEstimated reading time: 1 minute
While previous industrial revolutions have introduced factories, mass production, and computer-controlled systems, the advent of Industry 4.0 and the concept of the Smart factory have ushered in a new era in PCB manufacturing. For the PCB industry it is a very ambitious and aspirational objective to evolve from disconnected processes to an integrated system with automated data capture, real-time data analysis, process visualization, autonomous control, and self-correcting processes.
Industry experts claim that those who fail to engage will rapidly fall behind, however, the paradigm shift that this revolution brings to manufacturing has left many plant managers wondering where and how to start the process of implementation. The reality is that implementation of a Smart factory is not a one-size-fits-all approach, and companies need to adapt their existing systems, process, and infrastructures to embrace this transformation gradually.
In the PCB manufacturing plant, there is a profusion of design and production data that is held in many places and in many different formats. There is an opportunity to incorporate this information with data gathered in real time from manufacturing processes to provide intelligent analysis, derived actions, and control immediately for use throughout the manufacturing process chain. Very few companies will start a Smart manufacturing implementation from nothing. The key will be to understand how to adapt existing systems, process, and infrastructures to the requirements of the Smart factory. A step-by-step implementation focused on key aspects of manufacturing will allow the benefits to be realized soon. Therefore, the smart manufacturing solutions implemented should be modular, scalable, and flexible. This approach allows businesses to establish proof of concept, leverage existing equipment, and strengthen their infrastructure without the need for building entirely new factories. To embark on this journey successfully, it is crucial to harness the power of data and transform it into actionable information and knowledge.
To read this entire article, which appeared in the November 2023 issue of PCB007 Magazine, click here.
Share on:
Suggested Items
ViTrox Marks 25 Years of Innovation with Cutting-Edge Solutions at NEPCON China 2025 in Shanghai
04/18/2025 | ViTrox TechnologiesViTrox, which aims to be the World’s Most Trusted Technology Company, is proud to announce its participation in NEPCON China 2025, taking place from April 22–24, 2025, at Booth #1E45, Shanghai World Expo Exhibition & Convention Centre (SWEECC).
Nortech Positioned to Serve Global Markets Amid Tariff Challenges
04/18/2025 | BUSINESS WIRENortech Systems, a global leader in digital connectivity solutions and data management engineering, is strategically positioned to serve customers in Europe and the Asia Pacific region while effectively mitigating the impact of global tariffs and trade challenges.
Can the Electronics Industry Balance Tariffs With Investment?
04/18/2025 | I-Connect007 Editorial TeamTo better understand the U.S. administration’s recent actions on global trade policies, Barry Matties and Nolan Johnson met with Richard Cappetto, IPC’s senior director of North American government relations, who highlighted both the challenges and opportunities available to U.S. companies in the recent trade activity. This could include increased domestic manufacturing and supply chain diversification.
University of Arizona Pioneering Technical Education Beyond Semiconductors
04/18/2025 | Marcy LaRont, PCB007 MagazineWhile many universities struggle to keep their curriculum up to date with the evolving needs of the electronics industry, the University of Arizona stands head and shoulders above the others. Its Center for Semiconductor Manufacturing incorporates five of the colleges at UA and emphasizes an interdisciplinary approach to prepare students for diverse careers in technology and manufacturing.
IPC President’s Award: Xaver Feiner
04/17/2025 | Nolan Johnson, SMT007 MagazineThroughout his career, Xaver Feiner, vice president of marketing and sales at Zollner Elektronik, has developed extensive expertise in account management and new business development with a strong focus on the semiconductor industry, aerospace, and industrial electronics. Xaver has cultivated a profound understanding of global markets and remains deeply engaged with the challenges and opportunities presented by digital transformation. Since 2020, he has been an active member of the IPC Europe Advocacy Group, where he is dedicated to advancing the position of the electronics industry and the EMS sector across Europe.