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iNEMI Packaging Tech Topic Webinar: Equipment Capabilities and Challenges to Support Advanced Packaging Trends

07/26/2024 | iNEMI
Modern day computing needs, notably AI/machine learning and high-performance computing, along with their subsequent memory and I/O requirements, are fueling an increased demand for semiconductor devices with higher performance, lower power consumption and latency as well as reduced footprint.

BPMI Inc. Uses IPC Standards to Support the U.S. Nuclear-powered Naval Fleet

07/23/2024 | Linda Stepanich, IPC
Our IPC member profile focuses on Bechtel Plant Machinery Inc (BPMI), responsible for the fabrication, test, delivery, installation, and field support of high-quality nuclear power plant components for installation in submarines and aircraft carriers.

Vertical Aerospace Begins Testing on New VX4 Prototype

07/22/2024 | BUSINESS WIRE
Vertical Aerospace, a global aerospace and technology company that is pioneering zero emissions aviation, announced that testing on its most advanced eVTOL aircraft, unveiled last week, has started with initial powered ground tests, including propeller balancing, successfully complete.

Intel’s Whole-Vehicle Approach to Boost Automakers Profits

07/22/2024 | Intel
Nearly every aspect of the automotive industry is undergoing significant transformation – from business models and supply chains to exciting new in-vehicle experiences, including artificial intelligence. Unfortunately for automakers, these changes often come with increased costs, especially considering the expense of high-performance AI-enabled system-on-chips (SoCs) and, for electric vehicles (EVs), ever-larger and more expensive batteries.

onsemi Selected to Power Volkswagen Group’s Next-Generation Electric Vehicles

07/22/2024 | onsemi
onsemi announced it has signed a multi-year deal with Volkswagen Group to be the primary supplier of a complete power box solution as part of its next-generation traction inverter for its Scalable Systems Platform (SSP).
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