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Koh Young Showcases Inspection Innovations at IPC APEX EXPO 2025 in Anaheim, California during March 18-20, 2025

03/10/2025 | Koh Young
Koh Young, the global leader in True3D measurement-based inspection solutions and the exclusive Premier Sponsor of IPC APEX EXPO 2025, invites electronics manufacturers to Booth 2130 for an in-depth look at its cutting-edge inspection technologies. Taking place at the Anaheim Convention Center from March 18–20, 2025, this year’s event highlights Koh Young’s continued advancements in AI-powered process optimization and quality assurance.

BEST Inc. BGA Reballing Service Offers Unsurpassed Solutions for Commercial, Military and Aerospace Applications

03/05/2025 | BEST Inc.
BEST Inc., a leader in electronic component services, is pleased to announce it has expanded its BGA reballing solutions. Our BGA reballing process has been perfected over 20 plus years of reballing BGAs for electronic manufacturers across the country.

Drip by Drip: Semiconductor Water Management Innovations

03/05/2025 | IDTechEx
Not only does semiconductor manufacturing require large volumes of energy, chemicals, and silicon wafers, it also requires vast volumes of water. IDTechEx’s latest report, “Sustainable Electronics and Semiconductor Manufacturing 2025-2035: Players, Markets, Forecasts”, forecasts water usage across semiconductor manufacturing to double by 2035, as demand for integrated circuits continues to rise. 

Empowering Women in Electronics: An Evening of Connection and Inspiration

03/12/2025 | Alicia Balonek, IPC
The Women in Electronics Reception at IPC APEX EXPO on Tuesday, March 19, from 6–7:30 p.m., promises to be an evening of inspiration, camaraderie, and empowerment. With the theme “Eagerly Empowering Worn-Out Professionals with Humor, Hindsight, and Hallelujahs,” the event aims to rejuvenate and energize professionals in the electronics industry, a sector where women are underrepresented yet make invaluable contributions.

Murata, Rohde & Schwarz jointly enhance power efficiency of 5G and 6G devices through Digital Envelope Tracking

03/05/2025 | Murata
Murata Manufacturing is launching the world’s first Digital Envelope Tracking (Digital ET) technology. This advanced technology has the potential to considerably reduce power consumption of advanced RF circuits for 5G and future 6G devices, contributing towards more energy efficiency in various applications.
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