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indie Semiconductor Extends Automotive Photonics Leadership with Advanced Optical Component Integration Capabilities

11/20/2024 | indie Semiconductor
indie Semiconductor, an automotive solutions innovator, has extended its photonics offering with the addition of in-house photonics integration, packaging and system test capabilities.

ASMPT: Highly Flexible Die and Flip-chip Bonder for Co-packaged Optics Production

11/20/2024 | ASMPT
The high-precision AMICRA NANO die and flip-chip bonder has been specially developed for the production of co-packaged optics where which optical and electronic components are integrated in a common housing. With its exceptional process stability and a placement accuracy of ±0.2 μm @ 3 σ, this innovative bonding system is ideally equipped for the communication technology of the future.

L3Harris Delivers Optical System to NASA for Nancy Grace Roman Space Telescope

11/19/2024 | L3Harris Technologies
L3Harris Technologies has delivered the Optical Telescope Assembly (OTA) to NASA that serves as the critical “eye” for the Nancy Grace Roman Space Telescope by providing precise and stable imagery.

Indium Corporation to Showcase Precision Gold Solder Solutions at MEDevice Silicon Valley 2024

11/18/2024 | Indium Corporation
Indium Corporation® will feature its high-reliability AuLTRA® MediPro gold solder solutions at MEDevice Silicon Valley, taking place on November 20-21 in Silicon Valley, California. AuLTRA® MediPro is a family of high-performance, precision gold solder solutions for critical medical applications.

SCHMID Group Unveils Revolutionary Hyper Loop System (HLS) for Precision Etching with Sustainable Technology

11/07/2024 | SCHMID Group
The SCHMID Group is excited to introduce the Hyper Loop System (HLS), an innovative solution setting new standards in etching technology by combining high efficiency with sustainable benefits.
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