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NVIDIA’s AI Rack Transition Accelerates; NVL72 Output Value to Exceed $710 Billion in 2027

08/28/2026 | TrendForce
TrendForce’s recent AI server industry report reveals that GB300 rack-scale solutions are set to be NVIDIA’s leading driver of shipments in 2026, with demand anticipated to remain robust through the first half of 2027.

Decoding the CMMC Suspension

08/25/2026 | Divyash Patel, MX2 Technology
The recent CMMC suspension put all of us in something of a state of shock and confusion, and I have been closely following the discussion in the Defense Industrial Base (DIB) community, including vendors, customers, and cybersecurity specialists. In a memo to my clients, I shared some details for the decision. A common theme among those reasons is cost and capacity. We’ve learned that CMMC has prohibitive compliance costs, with individual bills approaching $600,000; SBA estimates above $7 billion annually across the base, that there is a severe assessor shortage; roughly 100,000+ firms need assessments from only about 100 approved organizations and that the DoD stood up a 60-day CMMC Reform Task Force to recommend a lower-barrier replacement framework.

Coherent Begins Sampling 300mm SiC Substrates for AI Infrastructure

08/24/2026 | Coherent
Coherent Corp. , a global leader in photonics, announced that it has begun sampling of its 300mm high thermal conductivity silicon carbide (SiC) substrates to leading AI semiconductor partners.

A Practical Approach to Material Selection for High Power PCBs

08/17/2026 | Drew Delaney, Isola Group
With AI server architectures demanding high-power converter solutions to improve power efficiency and affordability, PCB design can challenge engineers who treat material selection as a single-variable problem. Pick a laminate for thermal conductivity, and you may experience a CTE mismatch that cracks vias after 50 thermal cycles. Optimize for dielectric loss, and you might sacrifice the isolation margin your certification depends on. High-power boards require consideration of multiple variables, including electrical, thermal, mechanical, reliability, and manufacturability, which cannot be optimized alone.

Remtec to Participate at PCB West 2026, Showcasing Advanced Ceramic PCB Technologies for High-Reliability Electronics

08/04/2026 | Remtec
Remtec President & CEO Brian Buyea invites Engineers, Designers and OEMs to discover the future of advanced ceramic circuit solutions.
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