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Scanfil Is Preparing for a Changing Trading Environment

03/19/2025 | Scanfil
As the potential for new tariffs continues to evolve, Scanfil is committed to ensuring that its global manufacturing network is prepared to offer support should the need arise for a shift of manufacturing locations, whether domestically or internationally.

SparkFun, Digi International Collaborate to Simplify LoRaWAN® IoT Deployment

01/07/2025 | PRNewswire
SparkFun Electronics, a leader in open-source embedded electronics, and Digi International ®, a leading global provider of complete end-to-end Internet of Things (IoT) connectivity products, solutions and services, announce the launch of a collaborative new development board, the SparkFun IoT Node for LoRaWAN®, as well as two kits, one each for North America and Europe, the SparkFun Digi X-ON™ Kit for LoRaWAN®

Are Our Stackup Rules No Longer Valid?

12/19/2024 | Cherie Litson, EPTAC MIT CID/CID+
Are the stackup rules we used to follow no longer valid? It depends on what you’re designing. Electrical rules change depending on your circuit. Fabrication rules change depending on which fabricator you’re working with. Today, we just have more options, and sometimes, cost is a bigger rule than anything else. If you search online for information about layer stackups, trace widths, and hole sizes in PCBs, you’ll find a variety of resources.

iNEMI HDI Socket Warpage Prediction and Characterization Webinar

11/15/2024 | iNEMI
High-density interconnect (HDI) sockets, primarily designed for CPUs and GPUs, are shifting toward larger form factors as the number of interconnect pins increases.

GPV Exhibits at Electronica 2024

09/19/2024 | GPV
From 12 to 15 November 2024, GPV participates at Electronica in Munich, Germany. Find us in Hall A1, stand no. 115.
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