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DuPont Earns Perfect Score in Human Rights Campaign Foundation's 2023-2024 Corporate Equality Index
December 8, 2023 | DuPontEstimated reading time: 1 minute
DuPont announced it has received a perfect score of 100 on the Human Rights Campaign Foundation's 2023-2024 Corporate Equality Index (CEI), the nation's foremost benchmarking survey and report measuring corporate policies and practices related to LGBTQ+ workplace equality.
The results of the 2023-2024 CEI showcase how U.S.-based companies are promoting LGBTQ+ friendly workplace policies in the U.S. and abroad. DuPont's efforts in satisfying all the CEI's criteria earned a score of 100 and the designation as recipient of the Equality 100 Award: Leader in LGBTQ+ Workplace Inclusion.
"At DuPont, we've set a goal to become one of the world's most inclusive workplaces, and receiving this recognition is an indication of the progress we're making," said Kim Markiewicz, Chief Diversity Equity and Inclusion Officer, DuPont. "To live our purpose of empowering the world with the essential innovations to thrive, we need the diversity of thought and creativity among our teams and our leaders. This means the environment we create for employees, through our inclusive employee benefits, anti-discrimination policies, supplier diversity efforts, and the support of our vibrant Employee Resource Groups, is a critical component of our success."
The CEI rates employers providing these crucial protections to over 20 million U.S. workers and an additional 18 million outside of the U.S.
The CEI rates companies on detailed criteria falling under four central pillars:
- Non-discrimination policies across business entities;
- Equitable benefits for LGBTQ+ workers and their families;
- Supporting an inclusive culture; and,
- Corporate social responsibility.
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Julia McCaffrey - NCAB GroupSuggested Items
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
On the Line With… Podcast: UHDI and RF Performance
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The Marketing Minute: Cracking the Code of Technical Marketing
09/17/2025 | Brittany Martin -- Column: The Marketing MinuteMarketing is never a one-size-fits-all endeavor, but the challenges are magnified for highly technical industries like electronics. Products and processes are complex, audiences are diverse, and the stakes are high, especially when your customers are engineers, decision-makers, and global partners who depend on your expertise.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.