-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInventing the Future with SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Orbit International Reports Consolidated Bookings for November 2023
December 12, 2023 | Globe NewswireEstimated reading time: 1 minute
Orbit International Corp., an electronics manufacturer and software solution provider, announced that its consolidated bookings for the month of November 2023 were in excess of $3,100,000. Deliveries for the November 2023 orders have already commenced and are expected to continue through the second quarter of 2025.
Mitchell Binder, President and CEO of Orbit International commented, “We are pleased to report that consolidated bookings for the month of November 2023 were in excess of $3,100,000 with the majority of our bookings for the month coming from our legacy businesses at our Orbit Electronics Group (”OEG”) and Orbit Power Group (“OPG”). Bookings for our OEG, exclusive of orders received by our Simulator Product Solutions (“SPS”) subsidiary, were approximately $2,000,000, highlighted by an approximately $1,500,000 order from a large defense contractor for a switch panel used on a U.S. Navy program. Additional orders received were for other switch panels and displays. Bookings at our OPG were in excess of $700,000, highlighted by an approximately $400,000 order for our VPX power supplies used on a major aircraft program.”
Binder added, “Orders for our SPS subsidiary were approximately $400,000 in November, which brought SPS’ record year-to-date bookings to approximately $10,600,000, an increase of approximately $5,400,000 or approximately 96%, when compared to total SPS bookings for all of 2022. In addition, SPS has certain remaining new and follow-on business opportunities that it hopes will be awarded prior to year-end, adding to its record bookings year, and achieving a year-over-year booking increase of over 100%.”
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/12/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest On the Line With... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
KYZEN to Feature High-Reliability MICRONOX Chemistries at IMAPS Symposium
09/10/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is pleased to announce its participation at the International Symposium on Microelectronics or IMAPS Symposium, taking place September 29-October 3 at Town & Country Resort in San Diego, CA.