Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
It’s Only Common Sense: Storytelling That Sells—Stop Pitching, Start Painting Pictures
The Right Approach: Get Ready for ISO 9001 Version 6
SEMI Announces Election of Two New International Board Members
December 13, 2023 | SEMIEstimated reading time: 1 minute
SEMI, the industry association serving the global electronics design and manufacturing supply chain, announced the election of two new members to the SEMI International Board: Kai Beckmann, Member of the Executive Board and CEO of the Electronics business sector of Merck KGaA, Darmstadt, Germany, and Benjamin Loh, Chair of the Management Board and President and CEO of ASM. The tenure of the new board members begins immediately.
“We congratulate the newly elected International Board members, Kai Beckmann and Benjamin Loh, and thank them for their commitment to guide SEMI in representing the global electronics manufacturing and design supply chain,” said SEMI President and CEO Ajit Manocha. “Kai and Benjamin add to the breadth and depth of knowledge on our Board of Directors and will help us to ensure that SEMI programs continue to advance semiconductor industry growth, address top concerns, and deliver exceptional member value.”
SEMI’s 18 independent voting directors and 11 emeritus directors represent companies from Europe, China, Japan, Korea, North America, and Taiwan, reflecting the global scope of the association’s activities. SEMI directors are elected by the general membership as voting members of the Board and can serve a total of five three-year terms.
Kai Beckmann joined the Executive Board of Merck KGaA, Darmstadt, Germany in April 2011. He has served as CEO of the Electronics business sector since September 2017. Under his leadership the business successfully transformed into a leading player in the global electronics materials market. Beyond Merck, he has several external mandates such as President of the German Federation of Chemical Employers' Associations and Chairman of the Advisory Board of Fraunhofer Institute for Computer Graphics Research.
Benjamin Loh was appointed Chair of the Management Board and President and CEO of ASM in May 2020. He is a non-executive director of ASMPT and in the past held positions as non-executive director at Schneeberger, Schweiter Technologies AG, and Liteq BV. Loh was a SEMI China regional advisory board member while employed with Unaxis Corporation and living in China from 2021 to 2005.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
ICAPE Group Unveils Exclusive Report on Sustainability in Electronics Manufacturing
09/15/2025 | ICAPE GroupICAPE Group, a global leader in printed circuit boards (PCBs) and custom electronics manufacturing, today announces the launch of its 2025 Industry Outlook & Innovation Report: Sustainability in Electronics Manufacturing. This exclusive report is accompanied by fresh insights from a dedicated Statista survey of 100 electronics manufacturing professionals, commissioned by ICAPE Group.
Panasonic Industry will Double the Production Capacity of MEGTRON Multi-layer Circuit Board Materials Over the Next Five Years
09/15/2025 | Panasonic Industry Co., Ltd.Panasonic Industry Co., Ltd., a Panasonic Group company, announced plans for a major expansion of its global production capacity for MEGTRON multi-layer circuit board materials today. The company plans to double its production over the next five years to meet growing demand in the AI server and ICT infrastructure markets.
Zhen Ding Expands PCB into Semiconductors at SEMICON Taiwan 2025; Advantech Drives AI Smart Parks
09/12/2025 | Zhen DingZhen Ding Technology Holding Co., Ltd., a global leader in the PCB industry, returned to exhibit at SEMICON Taiwan 2025. Positioning itself as an industry pioneer in "PCB expanding into semiconductors," the company showcased its latest strategic layout
Advanced Packaging: Preparation is Now
09/15/2025 | Nolan Johnson, I-Connect007In this interview, Matt Kelly, CTO for the Global Electronics Association, and Devan Iyer, chief strategist of advanced packaging, define advanced electronics packaging and the critical nature of getting it right in the electronics manufacturing field. They share details from their white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges,” and provide insight into how next-generation packaging will change the design, fabrication, and assembly of printed circuit boards, including the implications for final system assembly.
Zhen Ding Technology Highlights AI-Driven Transformation of the PCB Industry at SEMICON Taiwan 2025
09/11/2025 | Zhen Ding TechnologyArtificial intelligence (AI) is expanding rapidly, with almost no field left untouched by the wave of computing power-driven transformation.