Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

NXP Unveils Unified Robotics Platform to Speed Trusted Physical AI Deployment

11/12/2026 | NXP Semiconductors
NXP Semiconductors N.V. announced its new unified robotics platform built on NXP’s Neural Axis Architecture, a distributed foundation that securely connects sensing, real-time control, AI processing and communications across robotic systems.

Taiwan Panasonic Factory Fire Puts Supply Chain Under Further Pressure

11/10/2026 | Marcy LaRont, I-Connect007
A November 4 fire at Panasonic Industrial Devices Materials Taiwan’s plant in Hukou Township, Hsinchu County, killed two employees and injured five.

Asia-Pacific AI Infrastructure Spending to Reach US$32B by 2030

11/10/2026 | IDC
AI infrastructure spending in the Asia/Pacific excluding Japan and China (APeJC) region is entering its next phase of growth.

onsemi, Czech Ministry Agree to End SiC Expansion Project

11/09/2026 | onsemi
onsemi and the Czech Ministry of Industry and Trade confirmed that they will not proceed with the planned expansion to add end-to-end silicon carbide (SiC) production at onsemi's Rožnov pod Radhoštěm site, first announced in June 2024.

TI Marks 70 Years of Innovation in Europe

11/03/2026 | PRNewswire
Texas Instruments (TI) is celebrating 70 years of operations in Europe, demonstrating its long history of semiconductor innovation, research and development, manufacturing and customer partnership in the region.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in