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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Eltek Placed Purchase Orders for $4.5 Million
December 18, 2023 | PRNewswireEstimated reading time: 1 minute
Eltek Ltd., a global manufacturer and supplier of technologically advanced solutions in the field of printed circuit boards, announced the placement of purchase orders totaling $4.5 million for state-of-the-art machines, software, and a comprehensive service contract, with most deliveries scheduled for the first quarter of 2024, in connection with its planned expansion of its production capabilities. These purchase orders are in addition to the three production lines ordered in August 2023. The first production line is on its way to Eltek and it is scheduled be installed during the beginning of the first quarter of 2024.
"The capital investments outlined in these purchase orders align with Eltek's strategic vision and commitment to enhancing operational efficiency, expanding technological capabilities, and aligning with future product portfolios. The purchase orders also underscore the Company's dedication to upgrading its engineering capabilities to maintain a competitive edge in the dynamic PCB market. These strategic investments are integral to our broader Company vision. By focusing on operational efficiency and staying at the forefront of technological advancements, we aim to not only meet but exceed the evolving needs of our customers," commented Eli Yaffe, CEO of Eltek.
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Sweeney Ng - CEE PCBSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
A Necessary Shift From Gerber to IPC-2581
05/07/2026 | Tracy Riggan, Global Electronics AssociationIPC-2581 is an open, vendor-neutral data exchange standard developed by the Global Electronics Association to streamline the exchange of PCB design information across fabrication, assembly, and test. It replaces multiple legacy formats—including industry standards, Gerber, and ODB++—with a single, comprehensive, XML-based dataset that captures all manufacturing details.
Green Circuits Heads to Peterson SFB to Support Next-Gen Space and Defense Electronics
05/05/2026 | Green CircuitsThe event, hosted at Peterson Space Force Base, brings together key personnel and mission partners supporting critical U.S. defense and space operations.
Trouble in Your Tank: In Complex Systems, Design Rules Aren’t Optional
05/06/2026 | Michael Carano -- Column: Trouble in Your TankThere is no question that the electronics industry, especially in circuit board design and fabrication, advanced packaging, and innovation throughout the value chain, has seen a significant transformation, whether it be in materials, system architecture, HDI and ultra HDI, semiconductors, or chiplets. AI and high-performance computing (HPC) are driving change across several fronts, including material properties, assembly techniques (think hybrid bonding), and power management.
Meet Emerging Engineers: Patrick Owen and Eric Mickenbecker, Summit Interconnect
05/05/2026 | Michelle Te, I-Connect007Patrick Owen and Eric Mickenbecker both work for Summit Interconnect, and are in their second year of the Global Electronics Association’s Emerging Engineer Program with mentor Brian Chislea. They stopped by the I-Connect007 booth at APEX EXPO and shared a bit of their story with me. Patrick has worked at the Hollister, California, plant since 2018, while Eric has been at the Chicago site since 2023. Like many of their peers, they came to the electronics industry from different paths, but are both excited about making an impact.