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Current IssueSales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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Register Now for the IPC Design Competition 2024
December 19, 2023 | IPC StaffEstimated reading time: 1 minute
Every year, thousands of printed board design engineers spend countless hours completing and perfecting their designs. IPC is inviting these designers to put their skills to the test and compete to become the IPC Design Champion of 2024.
“I’m really excited about the IPC Design Competition,” said Patrick Crawford, Manager of Design Standards. “There’s still time to register, so don’t miss out.”
As in previous years, the IPC Design Competition is composed of two parts: a Virtual Heat and a Finals Heat. Each heat features a board design created especially for this competition by IPC instructor Kris Moyer.
The Virtual Heat consists of a full board buildup, starting with a component BOM, schematic, and use-case brief. Competitors will be responsible for completing the board and exporting a documentation package via Gerber or IPC-2581. Competitors can use their own preferred EDA tools.
This year, IPC has made this design easier to complete in the time allotted. The preliminary designs should take no longer than 10-12 hours for the average designer to complete. Competitors have 25 days to complete their Virtual Heat design and are judged on their implementation of design rules and layout per IPC standards as well as general implementation of DFX principles.
The Finalist Heat will take place at IPC APEX EXPO in Anaheim, California on April 9, 2024. Three finalists will be invited to IPC APEX EXPO for an in-person layout showdown. Competitors will be provided complimentary short-term licenses of Altium Designer to use for the Finals Heat.
Can you route the best board and take home the prize? If you think you have what it takes, register now by clicking here.
Registration closes January 12, 2024, so don’t wait!
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Sweeney Ng - CEE PCBSuggested Items
Creating Connections in Mexico
07/30/2025 | Michelle Te, Community MagazineA concerted effort by the Global Electronics Association—Mexico team over the past year has created inroads for the Global Electronics Association (formerly IPC) with leading electronics companies, government offices, and academic institutions in Mexico. “Our goal is to bring more awareness to what the Global Electronics Association is and what it offers,” says Lorena Villanueva, senior director. “We also aim to increase our membership. Of 3,200 members of the Global Electronics Association, only 180 are in Mexico.”
Powering Progress: Summer 2025 Community Magazine Now Available
07/22/2025 | Community MagazineIn the new Summer 2025 edition of Community Magazine, members of the Global Electronics Association demonstrate what progress really looks like—through innovation on the factory floor, influence on public policy, and investment in the next generation of engineers.
TRI to Exhibit at SMTA Queretaro Expo 2025
07/16/2025 | TRITest Research, Inc. (TRI), the leading provider of test and inspection systems for the electronics manufacturing industry, is pleased to announce plans to exhibit at the SMTA Querétaro Expo 2025, scheduled to take place on July 24, 2025, at the Querétaro Centro de Congresos y Teatro Metropolitano.
Global PCB Connections: Let the Spec Fit the Board, Not Just the Brand
07/17/2025 | Jerome Larez -- Column: Global PCB ConnectionsIf you’ve ever seen an excellent PCB quote delayed, or worse, go cold because of a single line on the fab print, you’re not alone. Often, that line reads something like, “Use 370HR only,” or “IT-180A required.” These and other brand-name materials are proven performers, but unless your design needs that specific resin system (say, for RF performance, thermal reliability, or stringent CAF resistance), you may inadvertently be holding your job hostage.
IPC Hall of Fame Spotlight Series: Highlighting Lionel Fullwood
07/15/2025 | Dan Feinberg, I-Connect007Many IPC members who have contributed significantly to IPC and our industry have been awarded the IPC Raymond E. Pritchard Hall of Fame (HOF) Award. Though many early HOF members have passed away and are unknown to today’s IPC membership, their contributions still resonate. This special series on IPC Hall of Fame members provides a reminder of who was honored and why. As a bonus, for those who are still around, we get to find out what these talented individuals are up to today.