A Progress Report: Investing in U.S. PCB Fabricators
December 19, 2023 | Nolan Johnson, I-Connect007Estimated reading time: 1 minute
In the geopolitical arena, the supply chain lessons learned during the pandemic continue to be addressed with long-range plans as well as short-term stopgaps. In this conversation, David Schild, executive director of the Printed Circuit Board Association of America (PCBAA), provides a progress update on the U.S. CHIPS Act, and some of the fan-out dynamics already playing out. As David explains, there is new investment in PCB fabrication that has nothing to do with the CHIPS Act.
Nolan Johnson: David, we’ve recently seen investment news for Calumet Electronics and TTM. In Calumet’s case, the cash is coming from DoD and the state of Michigan; in TTM’s case, it’s an internally funded project. What is the larger story here?
David Schild: This is a signal that the industry is willing to put its money where its mouth is, and that governments at both the state and federal level want to help. I’m very happy to see this, but it underscores that this is just two companies and millions of dollars, when we need to be talking about dozens of companies and billions of dollars.
We’re thrilled that Calumet has announced funding from both the state of Michigan and the Department of Defense to expand their organic substrate capabilities, and DoD-specific capabilities in the state of Michigan. TTM has announced a greenfield initiative to produce UHDI PCBs adjacent to its existing Syracuse facility. The industry is not sitting still. We're willing to actually invest dollars, but it won’t put our manufacturing in a competitive position until we have government support.
To read this entire conversation, which appeared in the December 2023 issue of PCB007 Magazine, click here.
Subscribe
Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.
Subscribe now to stay informed, competitive, and connected.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
A Necessary Shift From Gerber to IPC-2581
05/07/2026 | Tracy Riggan, Global Electronics AssociationIPC-2581 is an open, vendor-neutral data exchange standard developed by the Global Electronics Association to streamline the exchange of PCB design information across fabrication, assembly, and test. It replaces multiple legacy formats—including industry standards, Gerber, and ODB++—with a single, comprehensive, XML-based dataset that captures all manufacturing details.
Green Circuits Heads to Peterson SFB to Support Next-Gen Space and Defense Electronics
05/05/2026 | Green CircuitsThe event, hosted at Peterson Space Force Base, brings together key personnel and mission partners supporting critical U.S. defense and space operations.
Trouble in Your Tank: In Complex Systems, Design Rules Aren’t Optional
05/06/2026 | Michael Carano -- Column: Trouble in Your TankThere is no question that the electronics industry, especially in circuit board design and fabrication, advanced packaging, and innovation throughout the value chain, has seen a significant transformation, whether it be in materials, system architecture, HDI and ultra HDI, semiconductors, or chiplets. AI and high-performance computing (HPC) are driving change across several fronts, including material properties, assembly techniques (think hybrid bonding), and power management.
Meet Emerging Engineers: Patrick Owen and Eric Mickenbecker, Summit Interconnect
05/05/2026 | Michelle Te, I-Connect007Patrick Owen and Eric Mickenbecker both work for Summit Interconnect, and are in their second year of the Global Electronics Association’s Emerging Engineer Program with mentor Brian Chislea. They stopped by the I-Connect007 booth at APEX EXPO and shared a bit of their story with me. Patrick has worked at the Hollister, California, plant since 2018, while Eric has been at the Chicago site since 2023. Like many of their peers, they came to the electronics industry from different paths, but are both excited about making an impact.