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DOD Awards $46.2 Million to Revitalize the U.S. Defense Industrial Base On-Shoring of Advanced Packaging and Assembly
December 22, 2023 | U.S. Department of DefenseEstimated reading time: 1 minute

The Department of Defense announced an award of $46.2 million to GreenSource Fabrication LLC (GreenSource) via the Defense Production Act Investment (DPAI) Program. The award will enhance existing production capabilities at a manufacturing facility of state-of-the-art integrated circuits (IC) substrate, high-density interconnect (HDI) and ultra-high-density interconnect (UHDI), and advanced packaging.
"Re-shoring advanced packaging and assembly are essential to increase semiconductor supply chain security," said Dr. Laura Taylor-Kale, Assistant Secretary of Defense for Industrial Base Policy. "Expanding domestic production capability for printed circuit boards and advanced packaging is necessary to avert a shortfall that would severely impair national defense capability."
The award will enable GreenSource to scale up engineering, tooling, and manufacturing operations to establish a dedicated facility for IC substrate fabrication for a high-mix, low-volume offering of advanced interconnect solutions. These domestic production capabilities for HDI, UHDI, IC substrates, and advanced packaging are critical enabling technologies for sixth-generation systems and applications, including for radar, electronic warfare, information processing, and communications.
In calendar year 2023, the DPAI Program made 25 awards totaling $781 million. DPAI is overseen by the ASD(IBP)’s Manufacturing Capability Expansion and Investment Program (MCEIP), in the Office of the Deputy Assistant Secretary of Defense for Industrial Base Resilience.
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Highlights from the IMAPS Onshoring Advanced Packaging Workshop in Washington, D.C.
09/30/2025 | Marcy LaRont, I-Connect007IMAPS and the Global Electronics Association co-hosted the Onshoring Advanced Packaging and Assembly Workshop in Washington, D.C., in early September. Government leaders, including those from the Department of Defense, attended and were directly involved in organizing the content of the sessions. Jim Will, director of the U.S. Partnership for Assured Electronics, speaks about his role in the event.
Safran, Rheinmetall Sign Framework Agreement for Advanced Defense Solutions
09/29/2025 | SafranSafran Electronics & Defense and Rheinmetall Electronics have signed a new framework agreement at DSEI London, strengthening their long-term collaboration in the defense sector.
Wojskowe Zakłady Elektroniczne Spółka Akcyjna, Lockheed Martin Conduct Production Line Validation Milestones
09/29/2025 | Lockheed MartinWZE S.A. and Lockheed Martin recently performed a production line validation of two major Patriot Advanced Capability – 3 Missile Segment Enhancement (PAC-3 MSE) activities through the WISLA offset program.
Kodiak Assembly Solutions Renews ITAR Registration, Providing Secure and Compliant Manufacturing for Defense & Aerospace
09/25/2025 | Kodiak Assembly SolutionsKodiak Assembly Solutions LLLP, a leading electronics contract manufacturer, has successfully renewed its ITAR (International Traffic in Arms Regulations) registration.
Cyient DLM, A Voice from the Frontlines
09/24/2025 | Arpita Das, Global Electronics AssociationOnce seen as a low-cost, build-to-print destination, India’s EMS sector is rapidly emerging as a global hub for high-reliability electronics, particularly in strategic sectors like aerospace, defense, and medical. As such, we highlight some companies that exemplify the strength and potential of Indian manufacturing.