-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
Engineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
IPC's PCB Design for Manufacturability
December 28, 2023 | IPCEstimated reading time: 1 minute
Taught by an industry expert with more than 40 years of experience in the field, this 3-week online program, which starts Feb 20, 2024 | 12:00pm and runs through , is designed to provide the knowledge and skills necessary to reduce or eliminate design, documentation, and capability issues that often arise when completed PCB designs are sent to the fabricator for production.
Course Content
- DfM Course Introduction, Fabricator Capability and Materials
- Panelization, Stackups and Surface Finishes
- Conductive Features, Holes/Vias and Other Mechanical Features
- Masks and Inks, Impedance and Signal Loss, and Electrical Test
- FPC, Documentation and Specifications
- Participants receive the following helpful documents developed by Korf Consultancy LLC.
PCB Fabrication Design Rules
This editable document is designed to help PCB designers avoid many of the issues identified during the fabricator’s initial DFM review. It provides an extensive list of sample design rule parameters that designers can use to ensure that their designs are compatible with fabricator capabilities before the fabricator’s initial review. These globally representative design parameters are based on the most recent PCB design requirements.
Rigid PCB Fabrication Acceptance Specification
This editable document provides recommended qualification and performance specifications for all IPC-6012 requirements defined as AABUS (As Agreed Between User and Subscriber). Designers can use this document to inform fabricators of their company’s specific manufacturing, documentation, and quality requirements, inclusive of those that do not appear in IPC Standards.
Suggested Items
Robosys, ACUA Ocean + OREC Secure Funding For Collaborative Autonomy Project
12/25/2024 | RobosysAdvanced maritime autonomy developer, Robosys Automation, supported by USV manufacturer, ACUA Ocean, and Offshore Renewable Energy Catapult (OREC), have jointly secured grant funding through Innovate UK.
IPC Announces New Training Course: PCB Design for Military & Aerospace Applications
12/23/2024 | IPCIPC announced the launch of a new training course: PCB Design for Military & Aerospace Applications.
Effects of Advanced Packaging and Stackup Design
12/26/2024 | I-Connect007 Editorial TeamKris Moyer teaches several PCB design classes for IPC and Sacramento State, including advanced PCB design. His advanced design classes take on some really interesting topics, including the impact of a designer’s choice of advanced packaging upon the design of the layer stackup. Kris shares his thoughts on the relationship between packaging and stackup, what PCB designers need to know, and why he believes, “The rules we used to live by are no longer valid.”
Beyond Design: AI-driven Inverse Stackup Optimization
12/26/2024 | Barry Olney -- Column: Beyond DesignArtificial intelligence (AI) is transforming how we conceptualize and design everything from satellites to PCBs. Traditionally, stackup planning is a manual process that can be multifaceted and relies heavily on the designer's expertise. Despite having best practices and various field solvers to optimize parameters, stackup planning remains challenging for complex designs with advanced packaging, several layers, multiple power pours, and controlled impedance requirements.
Spotlight on PEDC: Filbert Arzola
12/19/2024 | Andy Shaughnessy, Design007 MagazineIPC and FED have teamed up to create a new PCB design conference in Vienna, Austria. The Pan-European Electronics Design Conference (PEDC) takes place Jan. 29-30 at the NH Danube City hotel in Vienna. Raytheon’s Filbert Arzola is presenting “Engineering and Adapting Model-based PCB Design in Step with Sustainability and Digital Twins” at PEDC. I asked Filbert to discuss what attendees can expect from his class.