Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

SMTA: Pan Pacific Strategic Electronics Symposium Program Finalized

12/17/2024 | SMTA
SMTA announced that the program is finalized for the 29th Annual Pan Pacific Strategic Electronics Symposium.  The event will take place from January 27 to 30, 2025 at the Sheraton Maui Resort on Maui, Hawaii. 

China Overtakes Germany and Japan in Robot Density

11/22/2024 | IFR
China's adoption of robots continues at a rapid pace: The country has surpassed Germany and Japan in the ratio of robots to factory workers, taking third place in the world in 2023.

iNEMI HDI Socket Warpage Prediction and Characterization Webinar

11/15/2024 | iNEMI
High-density interconnect (HDI) sockets, primarily designed for CPUs and GPUs, are shifting toward larger form factors as the number of interconnect pins increases.

Designers Notebook: Implementing HDI and UHDI Circuit Board Technology

10/23/2024 | Vern Solberg -- Column: Designer's Notebook
To accommodate new generations of high I/O semiconductor packaging, circuit board technology has undergone significant changes in both the fabrication process method and the criteria for base material selection. The reason behind these changes is the new high-function semiconductor package families that require more terminals than their predecessors and a significantly narrower terminal pitch.

Reliability Comparisons of FPBGA Assemblies Under Hot/Cold Biased Thermal Cycle

08/06/2024 | Thomas Sanders, Seth Gordon, Reza Ghaffarian, Jet Propulsion Laboratory
Current trends in microelectronic packaging technologies continue in the direction of smaller, lighter, and higher density packages. The telecommunications industry and particularly mobile/portable devices have a strong need for lighter and smaller products. The current emerging advanced packaging (AP) technologies, including system-in-package (SiP) and 2.5D/3D stacked packaging, added another level of complexity and challenges for implementation.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in