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EIPC to Hold Winter Conference
January 3, 2024 | EIPCEstimated reading time: 1 minute
A long time ago, say 70 years, when food started to become interesting, rather than rationed, one of the desserts that one looked forward to was a Black Forest Gateau. It had on the top something few had seen until then – black cherries. But if you really want to have your cake and eat it, you could do no better than head for the Black Forest in Germany for the EIPC Winter Conference which is to be held on Tuesday, 30 January and Wednesday, 31 January 2024 in Villingen-Schwenningen. The event will be held at the IHK Conference Centre and the Holiday Inn next to the IHK will be our overnight stay venue.
Our cherry on the cake will be a visit to Schweizer Electronic AG and in the evening we shall be dining, rather well, in the Aichhalder Mühle restaurant.
The whole conference is in fact a meal in itself, some might say a technical banquet, but if you would like to be a part of it, we strongly advise that you waste no time and register as soon as you can to make sure we have a seat available for you.
The conference will have papers from Schweizer Electronic, Dr. Nakahara, Custer Consulting, iNEMI, NanYa Plastics, Dyconex, SAT, Circuit Foil, Atotech and others. We will also be having a Quick Fire Walk Inn on the Wednesday afternoon on standardization, sustainability, quality and reliability.
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PEDC Call for Abstracts Deadline Extended to Aug. 31
08/20/2025 | I-Connect007 Editorial TeamThe second Pan-European Electronics Design Conference (PEDC) will take place Jan. 21-22, 2026, in Prague, Czech Republic. The call for abstracts deadline has been extended to Aug. 31. Organized jointly by the German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association (formerly IPC), PEDC serves as a European platform for knowledge exchange, networking, and innovation in electronics design and development.
Prague PEDC: Call for Abstracts Deadline July 31
07/16/2025 | Pan-European Electronics Design Conference (PEDC)The second Pan-European Electronics Design Conference (PEDC) will take place Jan. 21-22, 2026, in Prague, Czech Republic. The call for abstracts deadline is July 31. Organized jointly by the German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association PEDC serves as a European platform for knowledge exchange, networking, and innovation in electronics design and development.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/20/2025 | Andy Shaughnessy, I-Connect007It’s been a busy week in this industry, and we have news and articles from the PCB design, fabrication and assembly communities. Some of this news is out of this world. We may be losing the high ground—the really high ground. Columnist Jesse Vaughan explains how the U.S. seems to be falling behind in space, and how this could affect our ability to defend ourselves in the future. We have an update on the U.S.-China tariff talks, which seem to be moving forward, though sometimes at a snail’s pace.
IPC Issues Call for Participation for IPC APEX EXPO 2026
06/02/2025 | IPCIPC is now accepting abstracts for technical papers with presentations, posters, and professional development courses at IPC APEX EXPO 2026.
The Knowledge Base: Beyond the Badge—Why Membership Matters More Than Ever
05/28/2025 | Mike Konrad -- Column: The Knowledge BaseMembership in trade associations like the Surface Mount Technology Association (SMTA) offers substantial benefits that can significantly enhance a professional's career in the electronics manufacturing industry. These advantages encompass extensive networking opportunities, access to specialized technical conferences, and complimentary training programs, all contributing to professional growth and industry recognition.