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Northrop Grumman Strengthens Commitment to Poland’s National Security and Interoperability with Allies

11/01/2024 | Northrop Grumman
Northrop Grumman Corporation (NYSE: NOC) has signed Memorandums of Understanding (MOU) to collaborate as strategic partners with Exence and the Polish Air Force Institute of Technology, Instytut Techniczny Wojsk Lotniczych (ITWL).

Laser Photonics Signs Definitive Agreement to Acquire Control Micro Systems

10/31/2024 | BUSINESS WIRE
Laser Photonics Corporation (LPC), a leading global developer of industrial laser systems for cleaning and other material processing applications, today announced it signed a definitive agreement to acquire Control Micro Systems, Inc. (CMS) through an asset purchase agreement (APA).

Real Time with... SMTAI 2024: KYZEN's Process Control System and the Digital Factory

10/30/2024 | Real Time with...SMTAI
Nolan Johnson speaks with Tom Forsythe From KYZEN in this interview captured at SMTA International 2024.  Did you know that KYZEN products include more than just cleaning formulas? In this conversation, Tom Forsythe explains how their process control system plays an important role in implementing a digital factory.

Yamaha Reveals High-performance AOI Option for High-density and Lighting Assemblies

10/29/2024 | Yamaha IM
Yamaha Robotics Europe has introduced the YRi-V HS optical inspection (AOI) system with enhanced features for faster performance at high resolution and greater accuracy inspecting surface-mounted LEDs.

Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1

10/25/2024 | I-Connect007
The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.
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