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Flex Announces Completion of the Spin-Off of its Remaining Interest in Nextracker
January 4, 2024 | FlexEstimated reading time: Less than a minute
Flex announced the completion of the spin-off of all of its remaining interest in Nextracker Inc. to Flex shareholders on a pro rata basis.
Under the previously disclosed terms of the transaction, Flex shareholders received approximately 0.17 shares of Nextracker Class A common stock for every Flex ordinary share held as of the record date of December 29, 2023, with 74,432,619 shares of Nextracker Class A common stock issued to Flex shareholders in the aggregate. Flex shareholders will receive cash in lieu of any fractional shares.
As a result of the completion of the spin-off, Flex no longer directly or indirectly holds any shares of Nextracker common stock or any securities convertible into or exchangeable for shares of Nextracker common stock. Flex ordinary shares will continue to trade on Nasdaq under the ticker symbol "FLEX" and shares of Nextracker Class A common stock will continue to trade on Nasdaq under the ticker symbol "NXT".
Suggested Items
Nick Koop Launches IPC Flex Design Class
05/06/2025 | Andy Shaughnessy, Design007 MagazineNick Koop is director of flex technology for TTM Technologies, and he’s been a staple of IPC’s flex committees for decades. He’s also a longtime flex design instructor, and he’s about to debut a new IPC class, Flex and Rigid-Flex Design for Manufacturability, which will run May 12–21. In this interview, Nick tells us about this new class and what attendees can expect to learn.
ASC Sunstone Circuits to Exhibit at PCB Detroit 2025
05/05/2025 | ASC SunstoneASC Sunstone Circuits will be exhibiting at the inaugural session of PCB Detroit to be held on June 2 and 3 on the campus of Wayne State University.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/02/2025 | Marcy LaRont, PCB007 MagazineIn our industry, this week’s must-read features include CEE’s Tom Yang and his perspective on having a global business amidst tariff talk and other challenges. Joe Fjelstadt talks to the “Flexperts,” Nick Koop of TTM and Mark Finstead of Flexible Circuit Technologies. Nolan Johnson interviews the McGucken Group about the importance of empathic leadership in BANI times. NCAB’s Ryan Miller writes about reliability and compliance for building PCBs for medical applications, and surprise, more news from Siemens.
A Visit With ‘Flexperts’ Mark Finstad and Nick Koop
05/01/2025 | Joe Fjelstad, Verdant ElectronicsAt IPC APEX EXPO 2025, I chatted with seasoned flex experts Mark Finstad and Nick Koop about "Flexperts" and their roles as leading educators and in the realm of standards development for this increasingly indispensable electronic interconnection technology. They have been teaching about lessons learned and how to successfully navigate the “seas” of flexible circuits to help their students avoid the hazards that have taken down many of their predecessors in the past.
Real Time with... IPC APEX EXPO 2025: DuPont Electronics Materials and Innovations
04/23/2025 | Real Time with...IPC APEX EXPODuPont is many things to many markets, but DuPont Electronics Materials is, perhaps, a bit out of the DuPont "norm," developing specialized electronic materials that are particularly focused on challenging areas such as flex circuits, high power PCBs and products that must withstand harsh environments. At IPC APEX EXPO, Marcy LaRont sat down with Shannon Dugan from DuPont Electronics Materials to discuss some big news. They are being spun off into an independent entity with a new CEO having just been announced as the show wrapped.