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Suggested Items

Automation Meets Sustainability

09/08/2025 | Rick Nichols, GreenSource Engineering
GreenSource Engineering (GSE) is proud to have contributed to the first successful reshoring of a PCB facility on a greenfield site in the United States. While we are honored to have played a key role, full credit for this achievement goes to SEL for its vision, commitment, and professionalism.

SEL: Revolutionizing PCB Production Through MES, Partnerships, and Vision

08/21/2025 | Barry Matties, I-Connect007
Two years ago, we visited Schweitzer Engineering Laboratories (SEL) to better understand its new captive greenfield PCB facility. We recently returned, this time to discuss how this bold vision has transformed the industry. Barry Matties met with John Hendrickson, engineering director, and Jessi Hall, vice president of vertical integration, to discuss the transformative capabilities of Factory Core, SEL’s custom manufacturing execution system (MES), which allows for real-time monitoring of workflow and machine performance, and has led to impressive improvements in quality and cost efficiency.

U.S. Uses Secret Trackers to Trace AI Chips Diverted to China, Sources Say

08/18/2025 | I-Connect007 Editorial Team
Two sources told Reuters that U.S. authorities have secretly placed location trackers in some advanced chip shipments they see as at high risk of illegal diversion to China. They said the trackers are intended to locate AI chips that are sent to locations restricted by U.S. export laws, but authorities only examine some shipments.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

08/15/2025 | Marcy LaRont, I-Connect007
In our industry, my top reads include Prashant Patel’s overview and argument for reshoring, which I found to be a great general overview and breakdown. In further support of the onshoring/reshoring message, I’m highlighting Nolan Johnson’s interview on the survey and report by the Reshoring Initiative. Check out my interview with USPAE’s Jim Will on the state of the flat panel display (FPD) industry and the risks associated with it for U.S. defense and critical infrastructure products.

Materials and Manufacturing for the AI Era: The Next PCB Frontier

08/08/2025 | Edy Yu, Chief Editor, ECIO, and the I-Connect007 Editorial Team
AI is pushing hardware to its limits, and the bottleneck isn’t design anymore—it’s materials. Next-generation AI servers aren’t just heavier on layer counts. They demand better materials to handle the speed, heat, and signal integrity requirements of 400G, 800G, and even 1.6T Ethernet systems. Many server motherboards are already 32–36 layers. For the next wave of 1.6T-capable boards,  expect 40–50 layers, which must maintain high-frequency performance without degrading signal quality.
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