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Design007 Magazine's January 2024 Issue Released
January 9, 2024 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
Manufacturing Know-how
Our cover image for this month’s issue of Design007 Magazine is a great representation of the PCB development process where design, fabrication, and assembly are all intertwined. But designers, sitting at the front end of the entire development cycle, must have more than a passing understanding of the processes downstream from them. Some analysts estimate that 70% of the cost of the final board is determined during the design cycle. That’s a lot of responsibility.
So, this month, we asked our expert contributors to share their thoughts on the absolute “must-know” aspects of fab, assembly and test that all designers should understand. In the end, we’re all in this together.
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Flex Factory Recognized for Manufacturing Excellence and Continuous Improvement by the Association for Manufacturing Excellence
12/19/2024 | FlexFlex announced that its Zhuhai, China site, specializing in advanced assembly, tool design and manufacturing, and metal and plastics capabilities for Lifestyle and Data Center customers, received an Excellence Award from the Association for Manufacturing Excellence (AME) for demonstrating world-class continuous improvement and results. This is the third consecutive year a Flex facility received an AME Excellence Award.
Mycronic Introduces New Machine Models to Its High-Performance Pick-And-Place Platform MYPRO A40
12/06/2024 | MycronicMycronic, the leading Sweden-based electronics assembly solutions provider, is introducing two new machine models MYPro A40SX and A40LX to its next-generation MYPro A40 pick-and-place platform, equipped with the all-new MX7 high-speed mounthead technology.
IPC Announces Two New Courses to Enhance Electronics Manufacturing Excellence
12/03/2024 | IPCIPC is excited to announce the launch of two new courses designed to optimize electronics manufacturing processes: "Ensuring Excellence: IPC-J-STD-001 Process Optimization" and "Ensuring Excellence: IPC-A-610 Process Optimization."
Absolute EMS Enters Strategic Partnership with PTEC Solutions to Enhance End-to-End Electronics Manufacturing Capabilities
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Indium Technical Expert to Present at SiP Conference China
11/25/2024 | Indium CorporationIndium Corporation Senior Area Technical Manager for East China Leo Hu is scheduled to deliver a presentation on Low-Temperature Solder Material in Semiconductor Packaging Applications at SiP China Conference 2024 on November 27 in Suzhou, China.