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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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Change in Aspocomp’s Management Team
January 9, 2024 | AspocompEstimated reading time: Less than a minute
Aspocomp Group Plc changes the composition of its Management Team as of January 8, 2024.
Member of the Management Team, Chief Operating Officer, and Deputy CEO Antti Ojala has been appointed Chief Commercial Officer as of January 8, 2024. Mr. Ojala will also continue as Deputy CEO.
Pekka Holopainen has been appointed Chief Operating Officer, and member of the Aspocomp Management Team as of January 8, 2024. Mr. Holopainen has been working at Aspocomp since 2014, and the most recently he has held the position of Supply Chain Manager. Ari Beilinson leaves his position as Vice President, Sales and Marketing, and member of the Management Team, on January 8, 2024.
”I would like to thank Ari Beilinson warmly for his contribution as Aspocomp’s VP, Sales and Marketing, and wish him all the best for the future.” says CEO Mikko Montonen.
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