The Chemical Connection: Common Misconceptions in Wet Processing
It’s Only Common Sense: Selling to Engineers
American Made Advocacy: America, It’s Time to Reclaim Manufacturing Leadership
IPC to Host 3rd Annual Integrated Electronics Manufacturing & Interconnections (IEMI) Events in South Asia
January 10, 2024 | IPCEstimated reading time: 2 minutes
IPC India will host the third annual Integrated Electronics Manufacturing & Interconnections (IEMI), the largest industry networking event in South Asia for the electronics industry, to be held in Penang, Malaysia, and Bangalore, India.
Malaysia is India’s third largest trading partner in the Association of Southeast Asian Nations (ASEAN), and India is the largest trading partner for Malaysia in South Asia. The bilateral trade between India and Malaysia in 2023 reached 20 billion dollars and is expected to increase to 25 billion dollars in the next three years. Malaysia hosts the second-largest Indian community in the world. There is growing engagement in all aspects of the bilateral relationship and IPC sees semiconductor and electronics manufacturing as key areas for potential collaboration.
IEMI events are focused on bringing together players in the electronics industry – OEMs, EMS, PCB manufacturers, cable and wire harness manufacturers, advanced packaging and semiconductor companies, and electronics industry suppliers. Vertical market OEMs from aerospace, defense, automotive, medical, industrial automation, railways and telecom will participate in the event. IEMI offers strategic alliances, export leads, business partnerships, investment promotion, source products and services, and an opportunity to gain technical knowledge. Pre-event activities start in January 2024 at various locations in India and other countries.
Key features of the IEMI events include product displays, presentations by industry leaders, panel discussions, a vendor development program, business matchmaking meetings with international delegates, standards development sessions, awards program, hand soldering competitions, and a world wire harness competition.
As the biggest industry networking event in South Asia for the electronics industry, IEMI 2024 is expected to significantly contribute to the sector's progress with themes like “advanced packaging of semiconductors” for IEMI 2024 Penang, Malaysia and “defence and aerospace” for IEMI 2024, Bangalore, India. The Penang event is organized in conjunction with Electronics Manufacturing Expo Asia – the largest electronics show in Malaysia attracting more than 8,000 visitors.
“IPC has participated in the India and Malaysia electronics manufacturing market for many years, and we have observed significant certification growth recently,” said John Mitchell, IPC president and CEO. “India and Malaysia are dynamic markets for the global electronics manufacturing industry, and IEMI 2024 provides opportunities for members to expand their business and supply chain.”
“IEMI 2023 events in India achieved great positive feedback from the industry. We hosted more than 1,000 attendees from more than 10 countries, 200 business-to-business meetings, and 10 additional educational/networking activities. The success of IEMI events lies with the audience profile, eminent industry speakers, sponsors and exhibitors and we are committed to the growth of IEMI 2024,” said Gaurab Majumdar, executive director of IPC’s regional office in India.
Share on:
Suggested Items
2024 Global Semiconductor Materials Market Posts $67.5 Billion in Revenue
04/29/2025 | SEMIGlobal semiconductor materials market revenue increased 3.8% to $67.5 billion in 2024, SEMI, the global industry association representing the electronics design and manufacturing supply chain, reported in its Materials Market Data Subscription (MMDS).
New RF Materials Offer Options for RF Designers
04/29/2025 | Andy Shaughnessy, Design007 MagazineThe RF materials arena has changed quite a bit in the past decade. The newest thermoset laminates boast performance numbers that are almost competitive with PTFE, but without the manufacturability challenges. At IPC APEX EXPO this year, I spoke with Brent Mayfield, business development manager at AGC Multi Material America. Brent walked through some recent innovations in RF materials, advances in resin systems, and the many design trade-offs for RF engineers to consider for each material set.
Real Time with... IPC APEX EXPO 2025: Winner of the IPC Best Student Poster Award
04/29/2025 | Real Time with...IPC APEX EXPOSebastian Carrillo, winner of the Best Student Technical Poster Award, shares insights on his research in nanotechnology and plasmonics. His work on a metal insulator nano array focuses on light-matter interactions at the nanoscale. With advancements in manufacturing, applications include sensing technologies and photovoltaic systems. Sebastian discusses his project involving simulations and optical experiments. His career goals are in research, and he encourages students to seize academic opportunities.
New IPC Standard Sets First Global Benchmark for E-Textile Wearable Reliability
04/29/2025 | IPCIPC announces the release of IPC-8981, Quality and Reliability of E-Textile Wearables. This first-of-its-kind standard sets baselines for testing and classifying e-textile wearables, addressing key challenges in product reliability, performance, and quality assurance.
Rising Star Award: Paavo Niskala, TactoTek
04/28/2025 | Nolan Johnson, I-Connect007Paavo Niskala joined the IPC community in 2022 as part of the inaugural steering group for in-mold electronics. He led the development of standard IPC-8401, Guidelines for In-Mold Electronics, chairing the project from its inception to its publication in 2024. Currently, Paavo serves as vice chair of the D-84A Plastronics Accelerated Reliability Testing Task Group, contributing his expertise to advancing reliability standards in the field.