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ZESTRON's Denis Barbini, Ph.D. Presenting for IPC Engineering Webinar Series
January 10, 2024 | ZESTRONEstimated reading time: Less than a minute

ZESTRON, the forefront innovator in delivering precision cleaning solutions, comprehensive services, and expert training across the electronics manufacturing and semiconductor sectors, is delighted to announce the participation of Denis Barbini Ph.D., our esteemed Technical Solutions Manager, in an upcoming IPC Engineering Webinar Series. The webinar, "Overcoming the Challenges for Implementing IPC-J-STD-0001 in Your Factory," will be hosted by IPC, the global association for the electronics industry. The webinar will be taking place on Wednesday, February 7, 2024, from 1:00 – 2:00pm EST.
During the webinar, Denis Barbini Ph.D. will share practical strategies for successfully implementing IPC-J-STD-0001 standards in manufacturing environments. The session will guide participants in objectively evaluating material changes, acquiring quantitative data to mitigate risks, and incorporating tools for reliability. Expect valuable insights into overcoming common challenges and ensuring compliance and optimal performance in your manufacturing processes.
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"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.
Industry Leaders Shape a Sustainable Future at 2025 IPC CEMAC Electronics Manufacturing Annual Conference
09/30/2025 | Global Electronics AssociationThe 2025 IPC CEMAC Electronics Manufacturing Annual Conference, co-hosted by the Global Electronics Association and the Shanghai Pudong Association for Quality and Technology, successfully concluded on September 26 in Shanghai.