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IPC White Paper Calls for Comprehensive Roadmap to Address Advanced Packaging to Board-Level Integration Challenges

09/16/2024 | IPC
The increasing complexity of integrated systems demands a holistic approach to design, materials, assembly, reliability, and metrology across all levels of integration, from chip to package to board. IPC’s Technology Solutions group addresses these challenges and suggests a comprehensive roadmap in their new white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges.”

Duality AI Contracts with NASA JPL for Phase II of DARPA RACER Program

09/13/2024 | BUSINESS WIRE
Duality AI, the company behind Falcon, a digital twin simulation platform, today announced an agreement with NASA’s Jet Propulsion Laboratory (NASA JPL) in Pasadena to continue its work on Defense Advanced Research Projects Agency’s (DARPA’s) Robotic Autonomy in Complex Environments with Resiliency program (RACER).

ZESTRON to Exhibit & Present at Upcoming SMTA International 2024

09/13/2024 | ZESTRON
ZESTRON, the global leader in high-precision cleaning products, services, and training solutions for the electronics manufacturing industry, is excited to announce its participation in the upcoming SMTA International (SMTAI) (SMTAI) 2024.

US Navy Awards L3Harris $587M Contract for Next Generation Jammer – Low Band Program

09/13/2024 | BUSINESS WIRE
L3Harris Technologies has received a five-year contract, worth up to $587.4 million, to deliver custom tactical jamming pods designed to modernize the U.S. Navy’s Aerial Electronic Attack capability.

Flex Releases its 2024 Sustainability Report

09/13/2024 | Flex
Flex published its 2024 sustainability report, highlighting the company's global sustainability performance and progress from calendar year 2023.
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