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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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Market Value of Consumer Electronics 3D Sensing VCSEL Forecast to Soar to US$1.404 Billion by 2028
January 12, 2024 | TrendForceEstimated reading time: 1 minute
TrendForce’s latest report, “TrendForce 2024 Infrared Sensing Application Market and Branding Strategies” reveals a market decline for consumer electronics 3D sensing VCSEL in 2023 to US$847 million. This downturn has been attributed to a weak consumer market and pricing pressure.
Major brands incorporating 3D sensing in their 2023 consumer electronics include Apple (smartphones and tablets), Honor (smartphones), Meta Quest 3, and Magic Leap 2. The iPhone 15 Pro, featuring Sony’s stacked technology, integrates VCSEL/drive IC and SPAD/ISP (ASIC chips) in a compact stack. This not only reduces system size but also enhances the performance of LiDAR scanners at the same power level—extending battery life and improving camera and AR functionalities.
Major Apple developments include the adoption of MetaLenses in 2024 to minimize the size of transmitters. Furthermore, the company intends to implement under-display 3D sensing by 2027 to increase display-screen ratios. This technology, using short-wave infrared (SWIR) VCSEL, reduces interference from sunlight and ambient light while mitigating white spot phenomena. The adoption of SWIR VCSEL is expected to drive VCSEL prices up. TrendForce research indicates that ams OSRAM’s 1,130nm VCSEL demonstrates superior performance by achieving PCE>30% in 2H23.
The upcoming 2024 launch of the Apple Vision Pro, equipped with a trio of cutting-edge 3D sensing technologies—Structured Light, Direct Time of Flight (dToF), and Active Stereo Vision—is poised to significantly propel the 3D sensing market. This growth trajectory is further bolstered by the sustained introduction of AR and VR products from tech giants like Sony, Meta, Microsoft, and Google. As a result, the market value of consumer electronics 3D sensing VCSEL is forecast to reach US$1.404 billion by 2028, with an estimated CAGR of approximately 11% from 2023 to 2028.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/11/2025 | Andy Shaughnessy, Design007 MagazineThis week, we have quite a variety of news items and articles for you. News continues to stream out of Washington, D.C., with tariffs rearing their controversial head again. Because these tariffs are targeted at overseas copper manufacturers, this news has a direct effect on our industry.I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Infineon Advances on 300-millimeter GaN Manufacturing Roadmap as Leading Integrated Device Manufacturer (IDM)
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The Global Electronics Association Releases IPC-8911: First-Ever Conductive Yarn Standard for E-Textile Application
07/02/2025 | Global Electronics AssociationThe Global Electronics Association announces the release of IPC-8911, Requirements for Conductive Yarns for E-Textiles Applications. This first-of-its-kind global standard establishes a clear framework for classifying, designating, and qualifying conductive yarns—helping to address longstanding challenges in supply chain communication, product testing, and material selection within the growing e-textiles industry.
SMT007 Magazine July—What’s Your Competitive Sweet Spot?
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TRI Unveils New Multi-Camera AOI, TR7500 SIII Ultra
06/27/2025 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, proudly introduces the new TR7500 SIII Ultra.