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Kick Off the New Year With the Winter Issue of IPC Community!
January 15, 2024 | Michelle Te, I-Connect007Estimated reading time: 1 minute
We’ve compiled the best stories from around the electronics manufacturing industry and packed them into another issue of IPC Community. IPC staff and volunteers work on behalf of the industry to deliver timely and relevant content—from standards updates to important networking events—that impact the work we do each day.
What’s new this time?
- Joe Russeau is a test engineer by day and a cattle farmer by night (or early morning!) blending his interest in electronics with his passion for the land.
- It was a busy event season, and we’ve got reviews from several important events around the world, from the standards work of A-Teams at Gnomeapalooza to the world’s largest electronics show (productronica) and IPC Day Romania, where history meets cutting-edge technology.
- Find out why Shawn DuBravac states that “nearshoring is paving the way for a more interconnected and robust global economy.”
- How are standards created? It starts with a special committee of industry experts who gather as the Technical Activities Executive Committee Global team to get the ball rolling.
The issue also includes upcoming class schedules designed just for you, updates on the latest standards released, profiles on BOSTONtec and American Standard Circuits, and in-depth coverage of the IPC certification process—try 123,000 certifications in one year!
See your friends—and make some new ones— in the pages of IPC Community. Read it here.
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Julia McCaffrey - NCAB GroupSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
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Industry Leaders Shape a Sustainable Future at 2025 IPC CEMAC Electronics Manufacturing Annual Conference
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