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The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
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Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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Electronics Industry Welcomes Pentagon’s New National Defense Industrial Strategy
January 15, 2024 | IPCEstimated reading time: 1 minute
The following is a statement by Richard Cappetto, Senior Director, North American Government Relations at IPC, on the release of the National Defense Industrial Strategy (NDIS) yesterday by the U.S. Department of Defense. A fuller statement is in this IPC Blog.
“IPC is encouraged to see that the NDIS highlights several key priorities which we have been urging in recent years on behalf of the electronics industry. For example, the first pillar of the strategy sets forth eight actions to build resilient supply chains, including “continue and expand support for domestic production.” IPC believes all nations must ensure trusted, secure supply chains for essential electronics products.
“The second pillar of the strategy correctly identifies building a skilled workforce as a priority for a strong industrial base. Consistent with IPC’s policy agenda, the strategy calls for investments in upskilling and reskilling programs, better workforce pipelines into advanced manufacturing, and expansions of apprenticeship programs.”
IPC will continue to make the case for the U.S. government to take a “silicon to systems” approach to building up the electronics supply chain and the workforce. A healthy electronics ecosystem includes advanced packaging, IC substrates, printed circuit boards (PCBs), and electronics assembly, not just semiconductor chips.
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IPC Introduces First Standard for In-Mold Electronics
11/18/2024 | IPCIPC announces the release of IPC-8401, Guidelines for In-Mold Electronics. IPC-8401 addresses in-mold electronics (IME) technology, providing industry consensus on guidelines for manufacturing processes, part structures, material selection, and production test methods to integrate printed electronics and components into 3D smart structures.
Disruptive Innovation and Generative AI Inventor, Kevin Surace, to Keynote IPC APEX EXPO 2025
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Keysight Providing Software to Enable Researchers through the Microelectronics Commons
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Neways Partners with MilDef for the Production of Advanced Electronic Components
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