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Electronics Industry Welcomes Pentagon’s New National Defense Industrial Strategy
January 15, 2024 | IPCEstimated reading time: 1 minute
The following is a statement by Richard Cappetto, Senior Director, North American Government Relations at IPC, on the release of the National Defense Industrial Strategy (NDIS) yesterday by the U.S. Department of Defense. A fuller statement is in this IPC Blog.
“IPC is encouraged to see that the NDIS highlights several key priorities which we have been urging in recent years on behalf of the electronics industry. For example, the first pillar of the strategy sets forth eight actions to build resilient supply chains, including “continue and expand support for domestic production.” IPC believes all nations must ensure trusted, secure supply chains for essential electronics products.
“The second pillar of the strategy correctly identifies building a skilled workforce as a priority for a strong industrial base. Consistent with IPC’s policy agenda, the strategy calls for investments in upskilling and reskilling programs, better workforce pipelines into advanced manufacturing, and expansions of apprenticeship programs.”
IPC will continue to make the case for the U.S. government to take a “silicon to systems” approach to building up the electronics supply chain and the workforce. A healthy electronics ecosystem includes advanced packaging, IC substrates, printed circuit boards (PCBs), and electronics assembly, not just semiconductor chips.
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Foxconn's Rotating CEO, Yang Qiujin, Named One of Asia's Most Influential Women
10/15/2025 | Foxconn ElectronicsHon Hai Precision Industry Co., Ltd.'s management team has once again received recognition! Rotating CEO Kathy Yang has been named to Fortune magazine's " Most Powerful Women Asia 2025 " list of the 100 most influential women in Asia , achieving a remarkable fifth place in her debut.
Light-curable Solutions for Reliable Electronics in Space Applications
10/15/2025 | Virginia Hogan, DymaxDesigning electronics for space environments, particularly those in low Earth orbit (LEO), requires careful consideration of materials that can withstand extreme conditions while supporting long-term reliability. Engineers designing satellite systems, aerospace instrumentation, and high-altitude platforms face a familiar set of challenges: contamination control, mechanical stress, thermal cycling, and manufacturability.
Advanced Semiconductor Packaging Market Sees Rising Adoption Across Automotive and Industrial Sectors
10/14/2025 | openPRThe semiconductor packaging market size is estimated to reach at a CAGR of 7.2% during the forecast period (2024-2031).
Imec Launches 300mm GaN Program to Develop Advanced Power Devices and Reduce Manufacturing Costs
10/13/2025 | ImecImec, a world-leading research and innovation hub in nanoelectronics and digital technologies, welcomes AIXTRON, GlobalFoundries, KLA Corporation, Synopsys, and Veeco as first partners in its 300mm gallium-nitride (GaN) open innovation program track for low- and high-voltage power electronics applications.
NEDME Returns October 22 — The Northwest’s Premier Design & Manufacturing Expo
10/13/2025 | NEDMEThe Northwest Electronics Design & Manufacturing Expo (NEDME) returns on Wednesday, October 22, 2025, at Wingspan Event & Conference Center, Hillsboro. The event brings together engineers, product designers, manufacturers, educators, and community partners for a full day of industry connection, learning, and networking.