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Top 5 NAND Brands' Revenue Jumps 77% QoQ in 2Q26; Micron Rises to 3rd

08/18/2026 | TrendForce
TrendForce’s latest NAND Flash industry research reveals that AI server demand remained steady in the second quarter of 2026—particularly for enterprise SSDs—resulting in a supply shortage across the NAND Flash market.

NHanced Semiconductors, UF to Present Advanced Photonics Packaging at SMTAI 2026

08/18/2026 | PRNewswire
The upcoming SMTA International Conference will feature a paper titled “Advanced Packaging for Photonics: Hybrid Bonding and Silicon Interposer Integration,” presented by NHanced Semiconductors Vice President Dr. Charles Woychik and Dr. Navid Asadizanjani from the Florida Semiconductor Institute at University of Florida.

IBM, Together AI Partner to Scale Open-Source AI Inference on IBM Cloud

08/14/2026 | IBM
IBM announced a collaboration with Together AI to deliver IBM and NVIDIA AI infrastructure. Under a multi-year $240M agreement between IBM and Together AI, IBM is positioned to deploy a large cluster of NVIDIA HGX B300 systems on IBM Cloud with expected availability in Q1 2027.

Quantinuum, Oracle Partner on Hybrid Quantum Computing

08/13/2026 | Quantinuum
Quantinuum, a leading quantum computing company, and Oracle announced a multi-year strategic partnership to bring quantum computing to Oracle Cloud Infrastructure (OCI). Under the partnership, OCI customers will be able to directly access Quantinuum’s Helios, the most accurate commercial quantum computer in the world,  through OCI’s quantum service, alongside OCI’s high-performance computing (HPC) and GPU infrastructure.

Smart Textile Integration with Flex PCBs

08/10/2026 | Anaya Vardya, American Standard Circuits
The idea of clothing that monitors your health sounds like science fiction. It is not. Flex PCBs, integrated with conductive yarns and polymer substrates, are turning ordinary fabric into diagnostic platforms and turning your shirt into a medical device. The implications for healthcare, athletics, and workplace safety are profound. The fundamental engineering challenge of wearable electronics has always been the interface between two incompatible worlds: the rigid, planar world of conventional electronics and the soft, stretchy, washable world of textiles. Early smart garments solved this by simply attaching a rigid sensor pod to clothing, which was functional but bulky and uncomfortable. Flex PCBs collapse that boundary.
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